发明授权
- 专利标题： Circuit-connecting material and circuit terminal connected structure and connecting method
- 专利标题（中）： 电路连接材料和电路端子连接结构和连接方法
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申请号： US11227231申请日： 2005-09-16
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公开(公告)号： US07967943B2公开(公告)日： 2011-06-28
- 发明人: Itsuo Watanabe , Tohru Fujinawa , Motohiro Arifuku , Houko Kanazawa , Atushi Kuwano
- 申请人： Itsuo Watanabe , Tohru Fujinawa , Motohiro Arifuku , Houko Kanazawa , Atushi Kuwano
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Griffin & Szipl, P.C.
- 优先权： JP09-079422 19970331; JP09-079424 19970331; JP09-252933 19970918
- 主分类号： C09J5/00
- IPC分类号： C09J5/00 ; C09J113/00 ; C09J133/00 ; C09J163/00 ; B32B27/26 ; B32B27/28 ; B32B27/30 ; B32B27/38
摘要：
A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
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