发明授权
- 专利标题： Method of inspecting a semiconductor device and an apparatus thereof
- 专利标题（中）： 检查半导体器件的方法及其装置
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申请号： US12652427申请日： 2010-01-05
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公开(公告)号： US08040503B2公开(公告)日： 2011-10-18
- 发明人: Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
- 申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi High-Technologies Corporation
- 当前专利权人： Hitachi, Ltd.,Hitachi High-Technologies Corporation
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2000-061836 20000302
- 主分类号： G01N21/00
- IPC分类号： G01N21/00 ; G06K9/00
摘要：
A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
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