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    Method of inspecting a semiconductor device and an apparatus thereof
    6.
    发明授权
    Method of inspecting a semiconductor device and an apparatus thereof 有权
    检查半导体器件的方法及其装置

    公开(公告)号：US06888959B2

    公开(公告)日：2005-05-03

    申请号：US09791682

    申请日：2001-02-26

    申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

    发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

    IPC分类号： G01N21/956 ,  G06T7/00 ,  H01L21/66 ,  G06K9/00

    CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8861 ,  G01N2021/8867 ,  G06T7/97 ,  G06T2207/10152 ,  G06T2207/30148

    摘要： In order to inspect a substance to be detected such as a foreign substance in accordance with the condition of the surface of a sample to be inspected such as a semiconductor substrate manufactured in various manufacturing processes under a suitable inspection condition, this method includes the steps of: inspecting a substance to be detected on a sample to be inspected under a plurality inspection conditions, which are previously set, as a single unit to detect at least the data of a detected substance for each of the plurality of inspection conditions; checking the data of the detected substance for the respective inspection conditions against each other to make check data; analyzing the detected substance based on the check data of the detected substance to classify the detected substance; adding the data of classified detected substance to the coordinate data of the detected substance for the respective inspection conditions to make data relating to the classified detected substance for the respective inspection conditions; and selecting a suitable inspection condition based on the data relating to the classified detected substance for the respective inspection conditions.

    摘要翻译： 为了在适当的检查条件下，根据在各种制造工序中制造的半导体衬底等被检测样品的表面状况，检查异物等异物，该方法包括以下步骤： 在预先设定的多个检查条件下检查待检测样品上检测到的物质作为单个单元，至少检测多个检查条件中检测物质的数据; 检查相应检查条件的检测物质的数据，以进行检查数据; 基于检测到的物质的检查数据分析检测到的物质以对检测到的物质进行分类; 将各种检测条件的检测物质的坐标数据相加，对各检查条件进行分类检测物质的数据的添加; 以及基于与各检查条件的分类检测物质有关的数据来选择合适的检查条件。