发明授权
US08044408B2 SiC single-crystal substrate and method of producing SiC single-crystal substrate
有权
SiC单晶衬底和SiC单晶衬底的制造方法
- 专利标题: SiC single-crystal substrate and method of producing SiC single-crystal substrate
- 专利标题(中): SiC单晶衬底和SiC单晶衬底的制造方法
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申请号: US12469299申请日: 2009-05-20
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公开(公告)号: US08044408B2公开(公告)日: 2011-10-25
- 发明人: Tatsuo Fujimoto , Kohei Tatsumi , Taizo Hoshino , Masakazu Katsuno , Noboru Ohtani , Masashi Nakabayashi , Hiroshi Tsuge , Housei Hirano , Hirokatsu Yashiro
- 申请人: Tatsuo Fujimoto , Kohei Tatsumi , Taizo Hoshino , Masakazu Katsuno , Noboru Ohtani , Masashi Nakabayashi , Hiroshi Tsuge , Housei Hirano , Hirokatsu Yashiro
- 申请人地址: JP Tokyo
- 专利权人: Nippon Steel Corporation
- 当前专利权人: Nippon Steel Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L29/15
- IPC分类号: H01L29/15
摘要:
The invention provides a high-quality SiC single-crystal substrate, a seed crystal for producing the high-quality SiC single-crystal substrate, and a method of producing the high-quality SiC single-crystal substrate, which enable improvement of device yield and stability. Provided is an SiC single-crystal substrate wherein, when the SiC single-crystal substrate is divided into 5-mm square regions, such regions in which dislocation pairs or dislocation rows having intervals between their dislocation end positions of 5 μm or less are present among the dislocations that have ends at the substrate surface account for 50% or less of all such regions within the substrate surface and the dislocation density in the substrate of dislocations other than the dislocation pairs or dislocation is 8,000/cm2.
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