Invention Grant
- Patent Title: Method of manufacturing optical waveguide and method of manufacturing package board
- Patent Title (中): 制造光波导的方法及制造封装板的方法
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Application No.: US12076359Application Date: 2008-03-17
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Publication No.: US08048324B2Publication Date: 2011-11-01
- Inventor: Han-Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
- Applicant: Han-Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0092931 20070913
- Main IPC: G02B6/10
- IPC: G02B6/10

Abstract:
A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.
Public/Granted literature
- US20090072419A1 Method of manufacturing optical waveguide and method of manufacturing package board Public/Granted day:2009-03-19
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