Invention Grant
- Patent Title: Substrate carrier
- Patent Title (中): 基板载体
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Application No.: US11254426Application Date: 2005-10-20
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Publication No.: US08083912B2Publication Date: 2011-12-27
- Inventor: Thomas Klug , Oliver Heimel
- Applicant: Thomas Klug , Oliver Heimel
- Applicant Address: DE Alzenau
- Assignee: Applied Materials GmbH & Co. KG.
- Current Assignee: Applied Materials GmbH & Co. KG.
- Current Assignee Address: DE Alzenau
- Agency: Fulbright & Jaworski L.L.P.
- Priority: DE102005045718 20050924
- Main IPC: C25B9/00
- IPC: C25B9/00 ; C25B11/00 ; C25B13/00 ; C23C14/00 ; C23C16/00
Abstract:
A carrier for a substrate, wherein at least a part of the carrier contains a material with a coefficient of thermal expansion which is higher than the coefficient of thermal expansion of the substrate, wherein in a specified region of the carrier a bar is centrally fastened whose coefficient of thermal expansion is lower than that of the region on which it is fastened.
Public/Granted literature
- US20070069351A1 Substrate carrier Public/Granted day:2007-03-29
Information query
