发明授权
- 专利标题： Electronic device and method of fabricating the same
- 专利标题（中）： 电子装置及其制造方法
-
申请号： US11598816申请日： 2006-11-14
-
公开(公告)号： US08093101B2公开(公告)日： 2012-01-10
- 发明人: Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
- 申请人： Kaoru Sakinada , Takumi Kooriike , Shunichi Aikawa , Osamu Kawachi , Yasufumi Kaneda
- 申请人地址： JP Tokyo
- 专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Chen Yoshimura LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
公开/授权文献
- US20080111247A1 Electronic device and method of fabricating the same 公开/授权日：2008-05-15
信息查询
IPC分类:
