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    Surface acoustic wave device and manufacturing method of the same
    1.
    发明申请
    Surface acoustic wave device and manufacturing method of the same 失效
    声表面波装置及其制造方法相同

    公开(公告)号：US20060049489A1

    公开(公告)日：2006-03-09

    申请号：US11212914

    申请日：2005-08-29

    申请人： Naoyuki Mishima ,  Takumi Kooriike

    发明人： Naoyuki Mishima ,  Takumi Kooriike

    IPC分类号： H01L23/552

    CPC分类号： H03H9/1071 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H03H3/08 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap 32. The SAW device element is mounted on one of the metal patterns of the resin substrate. The resin cap is adhered to the resin substrate to cover the SAW device element. The surfaces of the resin substrate are flush with corresponding end surfaces of the resin cap.

    摘要翻译： 表面声波装置具有SAW器件元件10和容纳SAW器件元件的封装20。 该包装包括一个在其两个表面上形成有金属图案21和22的树脂基板20和一个树脂盖32。 SAW器件元件安装在树脂基板的一个金属图案上。 树脂盖粘附到树脂基板上以覆盖SAW器件元件。 树脂基板的表面与树脂盖的相应端面齐平。

    SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR
    3.
    发明申请
    SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR 失效
    表面声波装置及其制造方法

    公开(公告)号：US20090096321A1

    公开(公告)日：2009-04-16

    申请号：US12239525

    申请日：2008-09-26

    申请人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    发明人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    IPC分类号： H01L41/08 ,  H01L41/22

    CPC分类号： H03H9/059 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/1092 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49146 ,  H01L2924/00014

    摘要： A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.

    摘要翻译： 表面声波装置能够在没有任何特定的环境过程的情况下防止电极腐蚀。 表面声波装置包括压电基片，形成表面声波的电极，形成在压电基片上，压电基片上，围绕用于形成表面声波的电极的框状层，以及 盖体通过接合而形成在框状层上，从而在盖体和用于形成表面声波的电极之间形成中空部分。 框状层和盖体包括感光性树脂，盖体包括通孔，并且通过无卤热固性树脂密封通孔。

    Acoustic surface wave device
    6.
    发明授权
    Acoustic surface wave device 失效
    声表面波装置

    公开(公告)号：US6037698A

    公开(公告)日：2000-03-14

    申请号：US615144

    申请日：1996-03-14

    申请人： Masanori Ueda ,  Yoshiro Fujiwara ,  Takumi Kooriike

    发明人： Masanori Ueda ,  Yoshiro Fujiwara ,  Takumi Kooriike

    IPC分类号： H03H9/25 ,  H03H9/05 ,  H03H9/64 ,  H03H9/10

    CPC分类号： H03H9/1071 ,  H03H9/058 ,  H03H9/64 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195

    摘要： This invention relates to an acoustic surface wave device suitably used in a high-frequency circuit, in which high attenuation characteristics are provided.The present invention includes an acoustic surface wave element, a ceramic package having a ceramic substrate of a multi-layer structure, the ceramic substrate having a die-attach portion on which the acoustic surface wave element is mounted, the ceramic package having an input terminal and an output terminal connected to the acoustic surface wave element, the ceramic package having an opening located above the ceramic substrate, each of the input terminal and the output terminal having a ground terminal, and a metallic cap sealing the opening of the ceramic package. The metallic cap is electrically connected to one of the ground terminal of the input terminal and the ground terminal of the output terminal.

    摘要翻译： 本发明涉及适用于提供高衰减特性的高频电路中的声表面波装置。 本发明包括声表面波元件，具有多层结构的陶瓷基片的陶瓷封装体，陶瓷基片具有安装声表面波元件的管芯附着部分，陶瓷封装具有输入端子 以及连接到所述声表面波元件的输出端子，所述陶瓷封装具有位于所述陶瓷基板上方的开口，所述输入端子和所述输出端子中的每一个具有接地端子，以及密封所述陶瓷封装的开口的金属盖。 金属盖电连接到输入端子的接地端子和输出端子的接地端子之间。

    Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap
    7.
    发明授权
    Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap 失效
    通过使用盖可靠地屏蔽芯片载体上的压电元件的压电元件封装

    公开(公告)号：US5838093A

    公开(公告)日：1998-11-17

    申请号：US803308

    申请日：1997-02-20

    申请人： Yoshimi Sakai ,  Takumi Kooriike

    发明人： Yoshimi Sakai ,  Takumi Kooriike

    IPC分类号： H01L21/56 ,  H03H9/10 ,  H03H9/25 ,  H01L41/08 ,  H03H9/15

    CPC分类号： H03H9/1071 ,  B81C1/00269 ,  B81B2201/0271 ,  B81C2203/019

    摘要： A piezoelectric element package includes a chip carrier having a shielding surface and a cavity for enclosing a piezoelectric element therein, and a cap having a central axis and a shielding material on a bottom surface of the cap, the cap shielding the piezoelectric element, enclosed in the cavity of the chip carrier, with the shielding material bonded to the shielding surface of the chip carrier. The cap is in a substantially circular shape and the shielding material of the cap and the shielding surface of the chip carrier are bonded to each other such that a bonding area between the shielding material and the shielding surface is unchanged.

    摘要翻译： 压电元件封装包括具有屏蔽表面的芯片载体和用于将压电元件封装在其中的空腔，以及在盖的底表面上具有中心轴线和屏蔽材料的盖，所述盖封闭在压电元件 芯片载体的腔体，屏蔽材料结合到芯片载体的屏蔽表面。 盖子是大致圆形形状，并且盖子的屏蔽材料和芯片载体的屏蔽表面彼此接合，使得屏蔽材料和屏蔽表面之间的接合面积不变。

    Method of manufacturing a surface acoustic wave device
    9.
    发明授权
    Method of manufacturing a surface acoustic wave device 失效
    声表面波装置的制造方法

    公开(公告)号：US07854050B2

    公开(公告)日：2010-12-21

    申请号：US12239525

    申请日：2008-09-26

    申请人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    发明人： Shunichi Aikawa ,  Takumi Kooriike ,  Jyouji Kimura

    IPC分类号： H04R17/10

    CPC分类号： H03H9/059 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/1092 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49146 ,  H01L2924/00014

    摘要： A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.

    摘要翻译： 表面声波装置能够在没有任何特定的环境过程的情况下防止电极腐蚀。 表面声波装置包括压电基片，形成表面声波的电极，形成在压电基片上，压电基片上，围绕用于形成表面声波的电极的框状层，以及 盖体通过接合而形成在框状层上，从而在盖体和用于形成表面声波的电极之间形成中空部分。 框状层和盖体包括感光性树脂，盖体包括通孔，并且通过无卤热固性树脂密封通孔。