公开(公告)号：US08076827B2

公开(公告)日：2011-12-13

申请号：US12560059

申请日：2009-09-15

申请人： Yasuyuki Saitou ,  Osamu Kawachi ,  Kaoru Sakinada ,  Yasuyuki Oda

发明人： Yasuyuki Saitou ,  Osamu Kawachi ,  Kaoru Sakinada ,  Yasuyuki Oda

IPC分类号： H01L41/053

CPC分类号： H03H3/08 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2924/00014 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1078 ,  Y10T29/42 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.

摘要翻译： 声波装置包括基板，具有压电基板并且被倒装安装在基板的表面上的器件芯片，具有比压电基板的介电常数低的介电常数的第一绝缘层， 器件芯片的与面向衬底的另一表面相对的表面以及密封器件芯片的金属密封部分。

公开(公告)号：US20090212399A1

公开(公告)日：2009-08-27

申请号：US12388215

申请日：2009-02-18

申请人： Yasufumi Kaneda ,  Akira Moriya ,  Kaoru Sakinada ,  Shunichi Aikawa ,  Yoshinori Kondou ,  Takashi Yamashita

发明人： Yasufumi Kaneda ,  Akira Moriya ,  Kaoru Sakinada ,  Shunichi Aikawa ,  Yoshinori Kondou ,  Takashi Yamashita

IPC分类号： H01L23/538 ,  H01L21/70

CPC分类号： H03H9/059 ,  H01L2924/0002 ,  H03H3/08 ,  H03H9/1092 ,  H01L2924/00

摘要： An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.

摘要翻译： 电子部件包括基板，形成在基板上的功能元件，多个端子，包括连接到功能元件的第一端子电极和层叠在第一端子电极上的第二端子电极，以及馈电线路，其一端 电连接到第一端子电极并且其另一端到达基板的边缘，其中馈电线包括直接到达边缘的第一部分和从第一部分分支然后到达边缘的第二部分。

公开(公告)号：US20080111247A1

公开(公告)日：2008-05-15

申请号：US11598816

申请日：2006-11-14

申请人： Kaoru Sakinada ,  Takumi Kooriike ,  Shunichi Aikawa ,  Osamu Kawachi ,  Yasufumi Kaneda

发明人： Kaoru Sakinada ,  Takumi Kooriike ,  Shunichi Aikawa ,  Osamu Kawachi ,  Yasufumi Kaneda

IPC分类号： H01L23/488 ,  B23K31/02 ,  H01L21/60

CPC分类号： B23K1/0016 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01079 ,  H03H9/059 ,  H03H9/1078 ,  H03H9/1085 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.

摘要翻译： 提供了一种制造电子器件的方法，该电子器件包括将器件芯片安装在衬底上的倒装芯片，以及通过在器件芯片上提供焊料并在焊料上施加热和压力来在相邻器件芯片之间提供焊料，以及接触角 的焊料熔化时，器件芯片和焊料大于90°。

公开(公告)号：US06404100B1

公开(公告)日：2002-06-11

申请号：US09419610

申请日：1999-10-18

申请人： Rieko Chujo ,  Masayoshi Koshino ,  Kaoru Sakinada

发明人： Rieko Chujo ,  Masayoshi Koshino ,  Kaoru Sakinada

IPC分类号： H03H900

CPC分类号： H03H9/1071 ,  H01L2224/16225 ,  H01L2924/16152 ,  H03H9/02897 ,  H03H9/02929

摘要： A surface acoustic wave apparatus includes a package having a concave-shaped base and a concave-shaped cap and a surface acoustic wave element housed in the package. The base has a mounting surface on which the surface acoustic wave element is mounted and a side wall raised from the periphery of the mounting surface. The side wall of the base is formed lower than the highest part of the surface acoustic wave element mounted on the mounting surface. Since the surface acoustic wave element mounted on the base is raised above the side wall of the base, the surface acoustic wave element is subjected easily to, for example, test, measurement, fault analysis, and others.

摘要翻译： 表面声波装置包括具有凹形基部和凹形帽的封装以及容纳在封装中的表面声波元件。 底座具有安装表面声波元件的安装表面和从安装表面的周边升起的侧壁。 底座的侧壁形成为比安装在安装面上的表面声波元件的最高部分低。 由于安装在基座上的表面声波元件在基座的侧壁上方突出，所以表面声波元件容易进行例如测试，测量，故障分析等。

公开(公告)号：US08363422B2

公开(公告)日：2013-01-29

申请号：US12540721

申请日：2009-08-13

申请人： Kaoru Sakinada ,  Yasuyuki Oda

发明人： Kaoru Sakinada ,  Yasuyuki Oda

IPC分类号： H05K7/14 ,  H05K7/18

CPC分类号： H05K1/144 ,  H01L23/10 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19105 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1071 ,  H05K2201/042 ,  H05K2201/09354 ,  H05K2201/10083 ,  H05K2201/10674 ,  H05K2201/10969 ,  H05K2203/1147 ,  H01L2224/0401

摘要： An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

摘要翻译： 电子部件模块包括：绝缘基板; 以倒装芯片安装在所述绝缘基板的第一表面上安装的器件芯片; 连接到所述绝缘基板的芯片部件; 设置在所述绝缘基板和所述器件芯片上方的盖; 第一金属图案，设置在绝缘基板的第一表面上的边缘部分中，以围绕绝缘基板的第一表面; 第二金属图案，设置在与第一表面相对的第二表面上的边缘部分中，以围绕第二表面; 以及密封焊料，其接合第一和第二金属图案，以便限定形成在位于绝缘基板和盖之间的区域中并且没有设置第一和第二金属图案并且进一步形成在绝缘体之间的空腔 基板和器件芯片。

公开(公告)号：US08093101B2

公开(公告)日：2012-01-10

申请号：US11598816

申请日：2006-11-14

申请人： Kaoru Sakinada ,  Takumi Kooriike ,  Shunichi Aikawa ,  Osamu Kawachi ,  Yasufumi Kaneda

发明人： Kaoru Sakinada ,  Takumi Kooriike ,  Shunichi Aikawa ,  Osamu Kawachi ,  Yasufumi Kaneda

IPC分类号： H01L21/00

CPC分类号： B23K1/0016 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01079 ,  H03H9/059 ,  H03H9/1078 ,  H03H9/1085 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.

摘要翻译： 提供了一种制造电子器件的方法，该电子器件包括将器件芯片安装在衬底上的倒装芯片，以及通过在器件芯片上提供焊料并在焊料上施加热和压力来在相邻器件芯片之间提供焊料，以及接触角 的焊料熔化时，器件芯片和焊料大于90°。

公开(公告)号：US20110156265A1

公开(公告)日：2011-06-30

申请号：US13040793

申请日：2011-03-04

申请人： Yasufumi KANEDA ,  Akira Moriya ,  Kaoru Sakinada ,  Shunichi Aikawa ,  Yoshinori Kondou ,  Takashi Yamashita

发明人： Yasufumi KANEDA ,  Akira Moriya ,  Kaoru Sakinada ,  Shunichi Aikawa ,  Yoshinori Kondou ,  Takashi Yamashita

IPC分类号： H01L23/48

CPC分类号： H03H9/059 ,  H01L2924/0002 ,  H03H3/08 ,  H03H9/1092 ,  H01L2924/00

摘要： An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.

摘要翻译： 电子部件包括基板，形成在基板上的功能元件，多个端子，包括连接到功能元件的第一端子电极和层叠在第一端子电极上的第二端子电极，以及馈电线路，其一端 电连接到第一端子电极并且其另一端到达基板的边缘，其中馈电线包括直接到达边缘的第一部分和从第一部分分支然后到达边缘的第二部分。

公开(公告)号：US20100038122A1

公开(公告)日：2010-02-18

申请号：US12540721

申请日：2009-08-13

申请人： Kaoru SAKINADA ,  Yasuyuki ODA

发明人： Kaoru SAKINADA ,  Yasuyuki ODA

IPC分类号： H05K1/18 ,  B23K37/00

CPC分类号： H05K1/144 ,  H01L23/10 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19105 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1071 ,  H05K2201/042 ,  H05K2201/09354 ,  H05K2201/10083 ,  H05K2201/10674 ,  H05K2201/10969 ,  H05K2203/1147 ,  H01L2224/0401

摘要： An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

摘要翻译： 电子部件模块包括：绝缘基板; 以倒装芯片安装在所述绝缘基板的第一表面上安装的器件芯片; 连接到所述绝缘基板的芯片部件; 设置在所述绝缘基板和所述器件芯片上方的盖; 第一金属图案，设置在绝缘基板的第一表面上的边缘部分中，以围绕绝缘基板的第一表面; 第二金属图案，设置在与第一表面相对的第二表面上的边缘部分中，以围绕第二表面; 以及密封焊料，其接合第一和第二金属图案，以便限定形成在位于绝缘基板和盖之间的区域中并且没有设置第一和第二金属图案并且进一步形成在绝缘体之间的空腔 基板和器件芯片。

公开(公告)号：US08153476B2

公开(公告)日：2012-04-10

申请号：US13040793

申请日：2011-03-04

申请人： Yasufumi Kaneda ,  Akira Moriya ,  Kaoru Sakinada ,  Shunichi Aikawa ,  Yoshinori Kondou ,  Takashi Yamashita

发明人： Yasufumi Kaneda ,  Akira Moriya ,  Kaoru Sakinada ,  Shunichi Aikawa ,  Yoshinori Kondou ,  Takashi Yamashita

IPC分类号： H01L21/44 ,  H01L21/30

CPC分类号： H03H9/059 ,  H01L2924/0002 ,  H03H3/08 ,  H03H9/1092 ,  H01L2924/00

摘要： An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.

摘要翻译： 电子部件包括基板，形成在基板上的功能元件，多个端子，包括连接到功能元件的第一端子电极和层叠在第一端子电极上的第二端子电极，以及馈电线路，其一端 电连接到第一端子电极并且其另一端到达衬底的边缘，其中馈电线包括直接到达边缘的第一部分和从第一部分分支然后到达边缘的第二部分。

公开(公告)号：US07816794B2

公开(公告)日：2010-10-19

申请号：US11314007

申请日：2005-12-22

申请人： Kaoru Sakinada ,  Takumi Kooriike ,  Shunichi Aikawa ,  Osamu Kawachi ,  Yasufumi Kaneda

发明人： Kaoru Sakinada ,  Takumi Kooriike ,  Shunichi Aikawa ,  Osamu Kawachi ,  Yasufumi Kaneda

IPC分类号： H01L23/29

CPC分类号： H03H9/1085 ,  H01L2224/97 ,  H03H9/1078 ,  H01L2224/81

摘要： An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.

摘要翻译： 电子装置包括由绝缘体制成的封装基板，在封装基板上安装倒装芯片的器件芯片和密封器件芯片的密封部分。 密封部分包括由焊料制成的侧壁。 包括侧壁的整个密封部分可以由焊料制成。 电子设备可以包括设置在密封部分上的金属层。