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US08115326B2 Flexible substrates having a thin-film barrier 有权
具有薄膜屏障的柔性基板

Flexible substrates having a thin-film barrier
Abstract:
Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
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