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    SURFACE NANOFABRICATION METHODS USING SELF-ASSEMBLED POLYMER NANOMASKS
    3.
    发明申请
    SURFACE NANOFABRICATION METHODS USING SELF-ASSEMBLED POLYMER NANOMASKS 有权
    使用自组装聚合物纳米颗粒的表面纳米化方法

    公开(公告)号：US20140202984A1

    公开(公告)日：2014-07-24

    申请号：US13748840

    申请日：2013-01-24

    Applicant: Mark Alejandro Quesada ,  Jianguo Wang ,  Ying Zhang

    Inventor： Mark Alejandro Quesada ,  Jianguo Wang ,  Ying Zhang

    IPC: B05D5/00

    CPC classification number: B05D5/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10S977/888

    Abstract: Methods for fabricating a nanopillared substrate surface include applying a polymer solution containing an amphiphilic block copolymer and a hydrophilic homopolymer to a substrate surface. The amphiphilic block copolymer and the hydrophilic homopolymer in the polymer solution self-assemble on the substrate surface to form a self-assembled polymer layer having hydrophobic domains adjacent to the substrate surface and hydrophilic domains extending into the self-assembled polymer layer. At least a portion of the hydrophilic domains may be removed to form a plurality of pores in the exposed surface of the self-assembled polymer layer. A protective layer may be deposited on the exposed surface as a mask for etching through the plurality of pores to form through-holes. A nanopillar-forming material may be deposited onto the substrate surface via the through-holes. Then, the remaining portion of the self-assembled polymer layer may be removed to expose a nanopillared substrate surface.

    Abstract translation: 制造纳米圆柱形基底表面的方法包括将含有两亲嵌段共聚物和亲水均聚物的聚合物溶液施加到基底表面。 聚合物溶液中的两亲性嵌段共聚物和亲水均聚物自组装在基材表面上以形成具有与基材表面相邻的疏水区域和延伸到自组装聚合物层中的亲水区域的自组装聚合物层。 亲水区域的至少一部分可以被去除以在自组装聚合物层的暴露表面中形成多个孔。 可以在暴露的表面上沉积保护层作为用于通过多个孔蚀刻的掩模以形成通孔。 可以通过通孔将纳米柱形成材料沉积到衬底表面上。 然后，可以除去自组装聚合物层的剩余部分以暴露出纳米圆柱形的衬底表面。

    Flexible hermetic thin film with light extraction layer
    4.
    发明授权
    Flexible hermetic thin film with light extraction layer 有权
    柔性密封薄膜与光提取层

    公开(公告)号：US08754434B1

    公开(公告)日：2014-06-17

    申请号：US13751638

    申请日：2013-01-28

    Applicant: Jacques Gollier ,  Glenn Eric Kohnke ,  Mark Alejandro Quesada ,  James Andrew West

    Inventor： Jacques Gollier ,  Glenn Eric Kohnke ,  Mark Alejandro Quesada ,  James Andrew West

    IPC: H01L21/00

    CPC classification number: H01L51/5253 ,  H01L51/5268

    Abstract: A protected organic light emitting diode includes an organic light emitting diode structure formed on a substrate, a hermetic barrier layer formed over at least part of the organic light emitting diode structure, and a light extraction layer. The barrier layer may include a glass material such as a tin fluorophosphate glass, a tungsten-doped tin fluorophosphate glass, a chalcogenide glass, a tellurite glass, a borate glass or a phosphate glass. The light extraction layer, which may be formed over the barrier layer, includes a high refractive index matrix material and at least one of scattering particles dispersed throughout the matrix material and a roughened surface.

    Abstract translation: 受保护的有机发光二极管包括形成在衬底上的有机发光二极管结构，在至少部分有机发光二极管结构上形成的气密阻挡层和光提取层。 阻挡层可以包括玻璃材料，例如氟磷酸锡玻璃，掺杂钨的锡氟磷酸盐玻璃，硫族化物玻璃，碲酸盐玻璃，硼酸盐玻璃或磷酸盐玻璃。 可以形成在阻挡层上的光提取层包括高折射率基体材料和分散在整个基体材料中的散射粒子和粗糙化表面中的至少一种。

    SEALING TECHNIQUE FOR DECREASING THE TIME IT TAKES TO HERMETICALLY SEAL A DEVICE AND THE RESULTING HERMETICALLY SEALED DEVICE
    6.
    发明申请
    SEALING TECHNIQUE FOR DECREASING THE TIME IT TAKES TO HERMETICALLY SEAL A DEVICE AND THE RESULTING HERMETICALLY SEALED DEVICE 有权
    密封技术可以减少手术时间，从而彻底地密封设备和结果密封的设备

    公开(公告)号：US20100193353A1

    公开(公告)日：2010-08-05

    申请号：US12755023

    申请日：2010-04-06

    Applicant: Bruce Gardiner Aitken ,  Chong Pyung An ,  Mark Alejandro Quesada

    Inventor： Bruce Gardiner Aitken ,  Chong Pyung An ,  Mark Alejandro Quesada

    IPC: C23C14/34

    CPC classification number: C23C14/06 ,  C03C3/247 ,  C03C8/24 ,  C03C17/3615 ,  C03C17/3649 ,  C03C17/3671 ,  C03C17/3678 ,  H01L51/5253

    Abstract: A sealing method for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device (e.g., a hermetically sealed OLED device) are described herein. The sealing method includes the steps of: (1) cooling an un-encapsulated device; (2) depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and (3) heat treating the encapsulated device to form a hermetically sealed device. In one embodiment, the sealing material is a low liquidus temperature inorganic (LLT) material such as, for example, tin-fluorophosphate glass, tungsten-doped tin fluorophosphate glass, chalcogenide glass, tellurite glass, borate glass and phosphate glass. In another embodiment, the sealing material is a Sn2+-containing inorganic oxide material such as, for example, SnO, SnO+P2O5 and SnO+BPO4.

    Abstract translation: 这里描述了用于减少密封装置所需的时间和所得的密封装置（例如，气密密封的OLED装置）的密封方法。 密封方法包括以下步骤：（1）冷却未封装的装置; （2）在冷却装置的至少一部分上沉积密封材料以形成封装装置; 和（3）对封装的装置进行热处理以形成密封装置。 在一个实施方案中，密封材料是低液相线温度无机（LLT）材料，例如锡 - 氟磷酸盐玻璃，掺杂钨的锡氟磷酸盐玻璃，硫族化物玻璃，碲酸盐玻璃，硼酸盐玻璃和磷酸盐玻璃。 在另一个实施例中，密封材料是含Sn2 +的无机氧化物材料，例如SnO，SnO + P2O5和SnO + BPO4。

    Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
    7.
    发明申请
    Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device 审中-公开
    使用含Sn2 +的无机材料进行低温烧结，以密封设备

    公开(公告)号：US20080206589A1

    公开(公告)日：2008-08-28

    申请号：US11803512

    申请日：2007-05-15

    Applicant: Bruce Gardiner Aitken ,  Mark Alejandro Quesada

    Inventor： Bruce Gardiner Aitken ,  Mark Alejandro Quesada

    IPC: B32B15/00 ,  B05D3/02 ,  B05D5/00

    CPC classification number: H01L51/5253 ,  Y10T428/1266

    Abstract: A method for inhibiting oxygen and moisture degradation of a device (e.g., an OLED device) and the resulting device are described herein. To inhibit the oxygen and moisture degradation of the device, a Sn2+-containing inorganic oxide material is used to form a barrier layer on the device. The Sn2+-containing inorganic oxide material can be, for example, SnO, blended SnO & P2O5 powders, and blended SnO & BPO4 powders.

    Abstract translation: 本文描述了一种用于抑制器件（例如，OLED器件）和所得器件的氧气和水分降解的方法。 为了抑制器件的氧气和水分降解，使用含Sn 2+ 2的无机氧化物材料在器件上形成阻挡层。 含Sn 2+的无机氧化物材料可以是例如SnO，SnO 2和P 2 O 5 O 5 O 3粉末，并且混合的SnO ＆lt; BPO＆gt; 4＆lt; 4＆gt;粉末。

    Durable tungsten-doped tin-fluorophosphate glasses
    8.
    发明申请
    Durable tungsten-doped tin-fluorophosphate glasses 有权
    耐用的钨掺杂的锡 - 氟磷酸盐玻璃

    公开(公告)号：US20080146431A1

    公开(公告)日：2008-06-19

    申请号：US11544262

    申请日：2006-10-06

    Applicant: Bruce Gardiner Aitken ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada

    Inventor： Bruce Gardiner Aitken ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada

    IPC: C03C3/247

    CPC classification number: C03C3/247 ,  C03C8/24

    Abstract: Tungsten-doped tin-fluorophosphate glasses are described herein which exhibit excellent humidity resistance, thermal resistance, and have a low glass transition temperature which makes them suitable for low temperature sealing applications, such as for encapsulating electronic components. In one embodiment, these glasses comprise 55-75% Sn, 4-14% P, 6-24% O, 4-22% F, and 0.15-15% W on a weight percent elemental basis.

    Abstract translation: 本文描述了钨掺杂的锡 - 氟磷酸盐玻璃，其表现出优异的耐湿性，耐热性，并且具有低玻璃化转变温度，这使得它们适合于低密封应用，例如用于封装电子部件。 在一个实施方案中，这些玻璃包含基于重量百分比的55-75％Sn，4-14％P，6-24％O，4-22％F和0.15-15％W。

    Tin phosphate barrier film, method, and apparatus
    9.
    发明申请
    Tin phosphate barrier film, method, and apparatus 审中-公开
    磷酸铁阻隔膜，方法和装置

    公开(公告)号：US20080048178A1

    公开(公告)日：2008-02-28

    申请号：US11509445

    申请日：2006-08-24

    Applicant: Bruce Gardiner Aitken ,  Chong Pyung An ,  Benjamin Zain Hanson ,  Mark Alejandro Quesada

    Inventor： Bruce Gardiner Aitken ,  Chong Pyung An ,  Benjamin Zain Hanson ,  Mark Alejandro Quesada

    IPC: H01L51/00 ,  H01L21/469

    CPC classification number: H01L51/5253 ,  C23C14/06 ,  H01L31/048 ,  Y02E10/50

    Abstract: A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.

    Abstract translation: 公开了一种用于抑制装置的氧气和水分渗透的方法，包括以下步骤：在所述装置的至少一部分上沉积磷酸铁低液相线温度（LLT）无机材料以产生沉积的磷酸锡LLT材料，并热处理 沉积的LLT材料在基本上无氧和无水的环境中以形成气密密封; 其中沉积LLT材料的步骤包括使用包含钨的电阻加热元件。 还公开了一种有机电子器件，其包括基板，至少一个电子或光电子层和磷酸锡LLT阻挡层，其中电子或光电子层气密地密封在磷酸铁LLT阻挡层和基板之间。 还公开了一种装置，其至少一部分用磷酸铁LLT阻挡层密封。

    Surface nanofabrication methods using self-assembled polymer nanomasks
    10.
    发明授权
    Surface nanofabrication methods using self-assembled polymer nanomasks 有权
    使用自组装聚合物纳米掩模的表面纳米加工方法

    公开(公告)号：US09050621B2

    公开(公告)日：2015-06-09

    申请号：US13748840

    申请日：2013-01-24

    Applicant: Mark Alejandro Quesada ,  Jianguo Wang ,  Ying Zhang

    Inventor： Mark Alejandro Quesada ,  Jianguo Wang ,  Ying Zhang

    IPC: C25F3/00 ,  H01B13/00 ,  B44C1/22 ,  H01L21/302 ,  H01L21/461 ,  B05D5/00 ,  B82Y40/00 ,  G03F7/00 ,  B82Y10/00

    CPC classification number: B05D5/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10S977/888

    Abstract: Methods for fabricating a nanopillared substrate surface include applying a polymer solution containing an amphiphilic block copolymer and a hydrophilic homopolymer to a substrate surface. The amphiphilic block copolymer and the hydrophilic homopolymer in the polymer solution self-assemble on the substrate surface to form a self-assembled polymer layer having hydrophobic domains adjacent to the substrate surface and hydrophilic domains extending into the self-assembled polymer layer. At least a portion of the hydrophilic domains may be removed to form a plurality of pores in the exposed surface of the self-assembled polymer layer. A protective layer may be deposited on the exposed surface as a mask for etching through the plurality of pores to form through-holes. A nanopillar-forming material may be deposited onto the substrate surface via the through-holes. Then, the remaining portion of the self-assembled polymer layer may be removed to expose a nanopillared substrate surface.

    Abstract translation: 制造纳米圆柱形基底表面的方法包括将含有两亲嵌段共聚物和亲水均聚物的聚合物溶液施加到基底表面。 聚合物溶液中的两亲性嵌段共聚物和亲水均聚物自组装在基材表面上以形成具有与基材表面相邻的疏水区域和延伸到自组装聚合物层中的亲水区域的自组装聚合物层。 亲水区域的至少一部分可以被去除以在自组装聚合物层的暴露表面中形成多个孔。 可以在暴露的表面上沉积保护层作为用于通过多个孔蚀刻的掩模以形成通孔。 可以通过通孔将纳米柱形成材料沉积到衬底表面上。 然后，可以除去自组装聚合物层的剩余部分以暴露出纳米圆柱形的衬底表面。

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