发明授权
- 专利标题: Semiconductor element and manufacturing method therefor
- 专利标题(中): 半导体元件及其制造方法
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申请号: US12676212申请日: 2009-07-03
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公开(公告)号: US08129758B2公开(公告)日: 2012-03-06
- 发明人: Masao Uchida , Masashi Hayashi , Koichi Hashimoto
- 申请人: Masao Uchida , Masashi Hayashi , Koichi Hashimoto
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Renner, Otto, Boisselle & Sklar, LLP
- 优先权: JP2008-178810 20080709; JP2008-323682 20081219
- 国际申请: PCT/JP2009/003111 WO 20090703
- 国际公布: WO2010/004715 WO 20100114
- 主分类号: H01L27/10
- IPC分类号: H01L27/10
摘要:
A semiconductor device includes: a semiconductor layer including silicon carbide, which has been formed on a substrate; a semiconductor region 15 of a first conductivity type defined on the surface of the semiconductor layer 10; a semiconductor region 14 of a second conductivity type, which is defined on the surface 10s of the semiconductor layer so as to surround the semiconductor region 15 of the first conductivity type; and a conductor 19 with a conductive surface 19s that contacts with the semiconductor regions 15 and 14 of the first and second conductivity types. On the surface 10s of the semiconductor layer, the semiconductor region 15 of the first conductivity type has at least one first strip portion 60 that runs along a first axis i. The width C1 of the semiconductor region 15 of the first conductivity type as measured along the first axis i is greater than the width A1 of the conductive surface 19s as measured along the first axis i. And the periphery of the conductive surface 19s crosses the at least one first strip portion 60, 61.
公开/授权文献
- US20100295062A1 SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR 公开/授权日:2010-11-25
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