发明授权
US08132707B2 Flow soldering apparatus and flow soldering method using a water content sensor
失效
流动焊接装置和使用含水量传感器的流焊方法
- 专利标题: Flow soldering apparatus and flow soldering method using a water content sensor
- 专利标题(中): 流动焊接装置和使用含水量传感器的流焊方法
-
申请号: US12867340申请日: 2009-04-10
-
公开(公告)号: US08132707B2公开(公告)日: 2012-03-13
- 发明人: Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
- 申请人: Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Hamre, Schumann, Mueller & Larson, P.C.
- 优先权: JP2008-102272 20080410
- 国际申请: PCT/JP2009/001661 WO 20090410
- 国际公布: WO2009/125601 WO 20091015
- 主分类号: B23K13/08
- IPC分类号: B23K13/08 ; B23K1/08 ; B23K31/12 ; B23K31/02
摘要:
The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.
公开/授权文献
- US20110031297A1 FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD 公开/授权日:2011-02-10