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公开(公告)号：US20090166398A1
公开(公告)日：2009-07-02
申请号：US12337826
申请日：2008-12-18
申请人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
发明人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
IPC分类号： B23K1/20
CPC分类号： B23K3/0653 , B23K2101/36 , H05K3/227 , H05K3/3468 , H05K3/3489 , H05K2203/081 , H05K2203/082
摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.
摘要翻译： 焊接装置具有输送电子电路板的输送机，将具有水作为溶剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水 去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到 电子电路板和冷却器。 除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。
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公开(公告)号：US07780057B2
公开(公告)日：2010-08-24
申请号：US12337826
申请日：2008-12-18
申请人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
发明人： Arata Kishi , Kimiaki Nakaya , Kenichiro Suetsugu
IPC分类号： B23K1/08
CPC分类号： B23K3/0653 , B23K2101/36 , H05K3/227 , H05K3/3468 , H05K3/3489 , H05K2203/081 , H05K2203/082
摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.
摘要翻译： 焊接装置具有输送电子电路板的输送机，将具有水作为溶剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水 去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到 电子电路板和冷却器。 除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。
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公开(公告)号：US20110031297A1
公开(公告)日：2011-02-10
申请号：US12867340
申请日：2009-04-10
申请人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
发明人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
CPC分类号： H05K3/3468 , B23K3/0653 , H05K3/3447 , H05K3/3489 , H05K2201/10151 , H05K2203/0126 , H05K2203/111 , H05K2203/163
摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.
摘要翻译： 本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。 换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意 样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。
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4.发明授权Flow soldering apparatus and flow soldering method using a water content sensor 失效流动焊接装置和使用含水量传感器的流焊方法公开(公告)号：US08132707B2
公开(公告)日：2012-03-13
申请号：US12867340
申请日：2009-04-10
申请人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
发明人： Kimiaki Nakaya , Kenichiro Suetsugu , Arata Kishi
CPC分类号： H05K3/3468 , B23K3/0653 , H05K3/3447 , H05K3/3489 , H05K2201/10151 , H05K2203/0126 , H05K2203/111 , H05K2203/163
摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.
摘要翻译： 本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。 换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意 样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。
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5.发明申请BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE 有权粘接材料，电子元器件，粘结结构和电子器件公开(公告)号：US20090242249A1
公开(公告)日：2009-10-01
申请号：US12302157
申请日：2007-05-18
CPC分类号： H05K3/3463 , B23K35/264 , C22C12/00 , Y10T428/12681 , Y10T428/31678
摘要： A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and to 0.2 wt % Ge.
摘要翻译： 熔融温度为270℃以上且不含铅的接合材料成本低廉。 电子元件和电子部件的电极使用含有以Bi为主成分的合金的接合材料接合，含有0.2〜0.8重量％的Cu和0.2重量％的Ge。
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6.发明授权Bonding material, electronic component, bonding structure and electronic device 有权接合材料，电子部件，接合结构和电子设备公开(公告)号：US08227090B2
公开(公告)日：2012-07-24
申请号：US12302157
申请日：2007-05-18
IPC分类号： B32B15/04
CPC分类号： H05K3/3463 , B23K35/264 , C22C12/00 , Y10T428/12681 , Y10T428/31678
摘要： A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.
摘要翻译： 熔融温度为270℃以上且不含铅的接合材料成本低廉。 电子元件和电子部件的电极使用包含含有Bi作为主要成分并且含有0.2〜0.8重量％的Cu和0.02〜0.2重量％的Ge的合金的接合材料接合。
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7.发明授权Method of soldering using lead-free solder and bonded article prepared through soldering by the method 失效使用该方法通过焊接制备的使用无铅焊料和接合制品的焊接方法公开(公告)号：US06702175B1
公开(公告)日：2004-03-09
申请号：US10009168
申请日：2001-12-07
申请人： Kazumi Matsushige , Toshihisa Horiuchi , Takashi Ikari , Kenichiro Suetsugu , Masato Hirano , Shunji Hibino , Atsushi Yamaguchi
发明人： Kazumi Matsushige , Toshihisa Horiuchi , Takashi Ikari , Kenichiro Suetsugu , Masato Hirano , Shunji Hibino , Atsushi Yamaguchi
IPC分类号： B23K106
CPC分类号： B23K1/06 , B23K1/20 , B23K35/262 , B23K2101/40 , B23K2101/42 , H05K3/3463
摘要： There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.
摘要翻译： 提供了一种焊接无铅焊料的方法，其降低无铅焊料的熔点并防止在由无铅焊料接合的部分处的接合强度的劣化，以及使用 焊接方法。 作为不含铅的锡的合金的无铅焊料熔化，并且当熔融的铅 - 铅焊料作为熔融的铅 - 铅焊料时，超声波振动至少与通过无铅焊料接合的接合体或无铅焊料起作用， 自由焊料固化。 因此，无铅焊料中含有的成分的晶体变细，并且防止了被包含的部件在接合物的接合界面处偏析，从而可以提高接合界面处的接合强度。
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8.发明授权Solder, electronic component mounted by soldering, and electronic circuit board 失效焊接，通过焊接安装的电子部件和电子电路板
公开(公告)号：US5962133A
公开(公告)日：1999-10-05
申请号：US981565
申请日：1997-12-19
CPC分类号： H05K3/244 , B23K35/0227 , B23K35/0244 , B23K35/26 , H01L23/49582 , H05K3/3463 , H05K3/3484 , B23K35/025 , H01L2924/0002 , H05K2201/0218 , H05K2201/10636 , H05K2203/0425 , H05K3/3421 , Y02P70/611 , Y10T428/24917 , Y10T428/2938 , Y10T428/294 , Y10T428/2951 , Y10T428/2991
摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
摘要翻译： PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。 出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。 提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。 焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。
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9.发明授权Image reading device having a light waveguide means widened toward an end nearest to an image surface 失效具有轻微波浪形图像的图像读取装置在图像面附近趋向一端
公开(公告)号：US5198655A
公开(公告)日：1993-03-30
申请号：US642271
申请日：1991-01-15
CPC分类号： H04N1/02835 , H04N1/02855 , H04N1/02865 , H04N1/0311 , H04N1/0312 , H04N1/0314
摘要： An image reading device includes: a light emitting element for irradiating light on an image surface; a light receiving element for receiving image information in the form of reflected light from the image surface; and light waveguide passages provided between the light emitting element and the image surface and between the light receiving element and the image surface, respectively, and at least the light waveguide passage for the light emitting element is widened at an end surface thereof at the image surface to a width wider than at the end surface at the light emitting element.
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公开(公告)号：US5037233A
公开(公告)日：1991-08-06
申请号：US447356
申请日：1989-12-07
申请人： Munekazu Nishihara , Kenichiro Suetsugu , Tetsuo Fukushima , Jyunji Ikeda , Yakeshi Yoshii , Masato Tanida , Kazumi Nishimura
发明人： Munekazu Nishihara , Kenichiro Suetsugu , Tetsuo Fukushima , Jyunji Ikeda , Yakeshi Yoshii , Masato Tanida , Kazumi Nishimura
CPC分类号： F16B21/183 , B62K19/22 , F16B11/008 , F16B1/0014 , F16B11/006 , F16B7/00 , Y10T403/471 , Y10T403/60 , Y10T403/74
摘要： A bicycle frame comprising a lug and a pipe to be fitted onto a projection at the lug, annular grooves opposite to each other being disposed at the mutual contact surfaces of the lug projection and pipe, wherein an unidirectional form memory alloy changeable of its outer diameter by heating is disposed in one of the opposite annular grooves, and the projection of the lug and the pipe are bonded at the fitting surfaces by means of a thermosetting adhesive, whereby the bicycle frame is high in safety and superior in productivity and has an improved bonding strength and mechanical juncture.
摘要翻译： 一种自行车车架，包括：凸耳和配合在凸耳上的突出部上的管道;相对于彼此相对的环形槽设置在凸耳突起和管道的相互接触表面处，其中单向形式记忆合金可改变其外径 通过加热设置在一个相对的环形槽中，并且凸耳和管的突出部通过热固性粘合剂结合在配合表面，由此自行车车架的安全性高，生产率优异，并且具有改进的 接合强度和机械接合面。
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