公开(公告)号：US20090166398A1

公开(公告)日：2009-07-02

申请号：US12337826

申请日：2008-12-18

申请人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

发明人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

IPC分类号： B23K1/20

CPC分类号： B23K3/0653 ,  B23K2101/36 ,  H05K3/227 ,  H05K3/3468 ,  H05K3/3489 ,  H05K2203/081 ,  H05K2203/082

摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

摘要翻译： 焊接装置具有输送电子电路板的输送机，将具有水作为溶​​剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水 去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到 电子电路板和冷却器。 除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。

公开(公告)号：US08132707B2

公开(公告)日：2012-03-13

申请号：US12867340

申请日：2009-04-10

申请人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

发明人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

IPC分类号： B23K13/08 ,  B23K1/08 ,  B23K31/12 ,  B23K31/02

CPC分类号： H05K3/3468 ,  B23K3/0653 ,  H05K3/3447 ,  H05K3/3489 ,  H05K2201/10151 ,  H05K2203/0126 ,  H05K2203/111 ,  H05K2203/163

摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

摘要翻译： 本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。 换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意 样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。

公开(公告)号：US07780057B2

公开(公告)日：2010-08-24

申请号：US12337826

申请日：2008-12-18

申请人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

发明人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

IPC分类号： B23K1/08

CPC分类号： B23K3/0653 ,  B23K2101/36 ,  H05K3/227 ,  H05K3/3468 ,  H05K3/3489 ,  H05K2203/081 ,  H05K2203/082

摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

摘要翻译： 焊接装置具有输送电子电路板的输送机，将具有水作为溶​​剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水 去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到 电子电路板和冷却器。 除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。

公开(公告)号：US20110031297A1

公开(公告)日：2011-02-10

申请号：US12867340

申请日：2009-04-10

申请人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

发明人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

IPC分类号： B23K1/19 ,  B23K31/12 ,  B23K1/20

CPC分类号： H05K3/3468 ,  B23K3/0653 ,  H05K3/3447 ,  H05K3/3489 ,  H05K2201/10151 ,  H05K2203/0126 ,  H05K2203/111 ,  H05K2203/163

摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

摘要翻译： 本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。 换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意 样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。

公开(公告)号：US20100101845A1

公开(公告)日：2010-04-29

申请号：US12605750

申请日：2009-10-26

申请人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi ,  Seiji Tokii ,  Masato Udaka

发明人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi ,  Seiji Tokii ,  Masato Udaka

IPC分类号： H05K1/02 ,  B23K31/02

CPC分类号： H05K3/3489 ,  B23K1/0016 ,  B23K1/203 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73104 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved.

摘要翻译： 一种电子器件制造方法，包括：在第一电路组件的电极上设置焊料; 在第二电路组件的一个表面上设置具有磁通作用的树脂，以便完全覆盖形成在第二电路组件的一个表面上的焊料凸块; 通过树脂将第二电路组件设置在第一电路组件上，使得设置在第一电路组件的电极上的焊料材料和第二电路组件的焊料凸块彼此接触; 并且将热能施加到焊料材料和焊料凸块之间的连接部分和树脂上。 通过进行这些处理，制造其中第一电路组件和第二电路组件接合在一起并且其接合部分被树脂密封的电子设备。 结果，在电子设备中，可以提高结点的可靠性。

公开(公告)号：US20090236036A1

公开(公告)日：2009-09-24

申请号：US12306610

申请日：2007-06-22

申请人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

发明人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

IPC分类号： B32B38/10 ,  C08L63/00 ,  B32B38/00 ,  B23K31/02

CPC分类号： H05K3/305 ,  C08G59/66 ,  C08G59/686 ,  C08K9/04 ,  C08L63/00 ,  H05K3/225 ,  H05K3/306 ,  H05K2201/0209 ,  H05K2203/1105 ,  H05K2203/176 ,  Y02P20/582 ,  Y02P70/613

摘要： A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board.

摘要翻译： 提供了一种树脂组合物，其可以在将电子部件安装在电路板上的过程中，在加热时防止低耐热性部件被损坏。 还提供了一种容易修复在安装过程中被确定为不合规格产品的电路板的方法，以及用于从确定为关闭的电路板分离和恢复有用的电路板和/或电子部件的方法 - 在安装过程中确定产品。 树脂组合物包含（A）100重量份的环氧树脂，（B）30〜200重量份的硫醇系固化剂，（C）5〜200重量份的有机 - 无机复合绝缘填料 和（D）0.5〜20重量份的咪唑类固化促进剂。 根据回收方法，通过在安装工序中将电路板的一部分或全部加热到树脂组合物的玻璃化转变温度以上且不高于110℃的温度，使树脂组合物软化。 ，并且从电路板分离和回收电子部件。

公开(公告)号：US08540903B2

公开(公告)日：2013-09-24

申请号：US12744994

申请日：2008-11-21

申请人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

发明人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

IPC分类号： H01B1/02 ,  H01B1/22 ,  H01B1/12 ,  H05K3/20 ,  H05K3/30 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC分类号： H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49128 ,  Y10T29/4913

摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

摘要翻译： 公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部形成的导电路径中的空隙生长水平降低， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

公开(公告)号：US20110095423A1

公开(公告)日：2011-04-28

申请号：US13000391

申请日：2009-10-27

申请人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

发明人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105

摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块和第二电极之间的多个接合部件 第二电极，经由凸块将第一电极与第二电极电连接;以及多个加强树脂部件，分别位于接合部件周围，以至少覆盖接合部件和接合部件与凸块之间的接合区域。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。

公开(公告)号：US08450859B2

公开(公告)日：2013-05-28

申请号：US13000391

申请日：2009-10-27

申请人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

发明人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105

摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块之间的多个接合部件和 所述第二电极经由所述凸块将所述第一电极与所述第二电极电连接，以及分别位于所述接合部件周围的多个增强树脂部件，以至少覆盖所述接合部件和所述凸块之间的接合部件和接合部。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。

公开(公告)号：US08182923B2

公开(公告)日：2012-05-22

申请号：US12427275

申请日：2009-04-21

申请人： Naomichi Ohashi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Takayuki Higuchi

发明人： Naomichi Ohashi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Takayuki Higuchi

IPC分类号： H01B1/22 ,  B32B15/08

CPC分类号： H01B1/22 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/0272 ,  Y10T428/31681 ,  H01L2224/05599

摘要： A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.

摘要翻译： 导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点 第二导电填料15℃至45℃。 并且第二通量的熔点等于或小于第二导电填料的熔点。