发明授权
- 专利标题： Three-dimensional integrated circuits with protection layers
- 专利标题（中）： 具有保护层的三维集成电路
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申请号： US13273845申请日： 2011-10-14
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公开(公告)号： US08148826B2公开(公告)日： 2012-04-03
- 发明人: Chen-Hua Yu , Wen-Chih Chiou , Weng-Jin Wu , Hung-Jung Tu , Ku-Feng Yang
- 申请人： Chen-Hua Yu , Wen-Chih Chiou , Weng-Jin Wu , Hung-Jung Tu , Ku-Feng Yang
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/31 ; H01L25/00 ; H01L21/58 ; H01L21/56
摘要：
A semiconductor structure includes a first die comprising a first substrate and a first bonding pad over the first substrate, a second die having a first surface and a second surface opposite the first surface, wherein the second die is stacked on the first die and a protection layer having a vertical portion on a sidewall of the second die, and a horizontal portion extending over the first die.
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