发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
-
申请号： US12155232申请日： 2008-05-30
-
公开(公告)号： US08164160B2公开(公告)日： 2012-04-24
- 发明人: Yuichi Nakao , Takahisa Yamaha
- 申请人： Yuichi Nakao , Takahisa Yamaha
- 申请人地址： JP Kyoto
- 专利权人： Rohm Co., Ltd.
- 当前专利权人： Rohm Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Rabin & Berdo, P.C.
- 优先权： JP2007-145809 20070531
- 主分类号： H01L29/92
- IPC分类号： H01L29/92
摘要：
A semiconductor device according to the present invention has a multilayer wiring structure laminating and disposing a plurality of with sandwiching an insulating film and includes: a copper wire having copper as a main component; an insulating film formed on the copper wire; an aluminum wire having aluminum as a main component and formed on the insulating film to be electrically connected to the copper wire via a via hole formed to penetrate through the insulating film; and a surface protective film formed on the aluminum wire; and the surface protective film formed with a pad opening exposing a portion of the aluminum wire as an electrode pad for electrical connection with an external portion.
公开/授权文献
- US20080296730A1 Semiconductor device 公开/授权日：2008-12-04
信息查询
IPC分类:
