发明授权
- 专利标题: Resistor random access memory cell device
- 专利标题(中): 电阻随机存取存储单元器件
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申请号: US12755897申请日: 2010-04-07
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公开(公告)号: US08178405B2公开(公告)日: 2012-05-15
- 发明人: Erh-Kun Lai , ChiaHua Ho , Kuang Yeu Hsieh
- 申请人: Erh-Kun Lai , ChiaHua Ho , Kuang Yeu Hsieh
- 申请人地址: TW Hsinchu
- 专利权人: Macronix International Co., Ltd.
- 当前专利权人: Macronix International Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Haynes Beffel & Wolfeld LLP
- 主分类号: H01L21/8242
- IPC分类号: H01L21/8242
摘要:
A memory cell device has a bottom electrode and a top electrode, a plug of memory material in contact with the bottom electrode, and a cup-shaped conductive member having a rim that contacts the top electrode and an opening in the bottom that contacts the memory material. Accordingly, the conductive path in the memory cells passes from the top electrode through the conductive cup-shaped member, and through the plug of phase change material to the bottom electrode. Also, methods for making the memory cell device include steps of forming a bottom electrode island including an insulative element and a stop element over a bottom electrode, forming a separation layer surrounding the island, removing the stop element to form a hole over the insulative element in the separation layer, forming a conductive film in the hole and an insulative liner over conductive film, etching to form a cup-shaped conductive film having a rim and to form an opening through the insulative liner and the bottom of the cup-shaped conductive film to the surface of the bottom electrode, forming a plug of phase change memory material in the opening, and forming a top electrode in contact with the rim of the cup-shaped conductive film.
公开/授权文献
- US20100197119A1 Resistor Random Access Memory Cell Device 公开/授权日:2010-08-05
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