发明授权
- 专利标题： Seal ring structure for integrated circuits
- 专利标题（中）： 集成电路的密封圈结构
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申请号： US12273552申请日： 2008-11-19
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公开(公告)号： US08188578B2公开(公告)日： 2012-05-29
- 发明人: Tung-Hsing Lee , Tien-Chang Chang , Yuan-Hung Chung
- 申请人： Tung-Hsing Lee , Tien-Chang Chang , Yuan-Hung Chung
- 申请人地址： TW Science-Based Industrial Park, Hsin-Chu
- 专利权人： Mediatek Inc.
- 当前专利权人： Mediatek Inc.
- 当前专利权人地址： TW Science-Based Industrial Park, Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L31/00 ; H01L23/58 ; H01L29/06
摘要：
A seal ring structure disposed along a periphery of an integrated circuit. The seal ring is divided into at least a first portion and a second portion. The second portion is positioned facing and shielding an analog and/or RF circuit block from a noise. A deep N well is disposed in a P substrate and is positioned under the second portion. The deep N well reduces the substrate noise coupling.
公开/授权文献
- US20090294929A1 SEAL RING STRUCTURE FOR INTEGRATED CIRCUITS 公开/授权日：2009-12-03
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