发明授权
- 专利标题： RFID tag assembly methods
- 专利标题（中）： RFID标签装配方法
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申请号： US12399913申请日： 2009-03-06
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公开(公告)号： US08188927B1公开(公告)日： 2012-05-29
- 发明人: Ronald Lee Koepp , Ronald A. Oliver , William T. Colleran , Yanjun Ma , Jay M. Fassett , Vincent C. Moretti
- 申请人： Ronald Lee Koepp , Ronald A. Oliver , William T. Colleran , Yanjun Ma , Jay M. Fassett , Vincent C. Moretti
- 申请人地址： US WA Seattle
- 专利权人： Impinj, Inc.
- 当前专利权人： Impinj, Inc.
- 当前专利权人地址： US WA Seattle
- 代理机构： Turk IP Law, LLC
- 主分类号： H01Q1/38
- IPC分类号： H01Q1/38
摘要：
RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
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