Invention Grant
- Patent Title: RFID tag assembly methods
- Patent Title (中): RFID标签装配方法
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Application No.: US12399913Application Date: 2009-03-06
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Publication No.: US08188927B1Publication Date: 2012-05-29
- Inventor: Ronald Lee Koepp , Ronald A. Oliver , William T. Colleran , Yanjun Ma , Jay M. Fassett , Vincent C. Moretti
- Applicant: Ronald Lee Koepp , Ronald A. Oliver , William T. Colleran , Yanjun Ma , Jay M. Fassett , Vincent C. Moretti
- Applicant Address: US WA Seattle
- Assignee: Impinj, Inc.
- Current Assignee: Impinj, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Turk IP Law, LLC
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
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