发明授权
- 专利标题: Method for fabrication conductive winding structure
- 专利标题(中): 导电绕组结构的制造方法
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申请号: US12326242申请日: 2008-12-02
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公开(公告)号: US08191239B2公开(公告)日: 2012-06-05
- 发明人: Ming-Tsung Lee , Yung-Yu Chang , Chen-Yu Yu , Jui-Yuan Hsu , Chen-Tsai Hsieh
- 申请人: Ming-Tsung Lee , Yung-Yu Chang , Chen-Yu Yu , Jui-Yuan Hsu , Chen-Tsai Hsieh
- 申请人地址: TW Taoyuan Hsien
- 专利权人: Delta Electronics, Inc.
- 当前专利权人: Delta Electronics, Inc.
- 当前专利权人地址: TW Taoyuan Hsien
- 代理机构: Kirton McConkie
- 代理商 Evan R. Witt
- 优先权: TW97120488A 20080602
- 主分类号: H01F7/06
- IPC分类号: H01F7/06
摘要:
A conductive winding structure, the fabricating method thereof, and the magnetic device having the same. The method for fabricating the conductive winding structure includes: (a) providing a mold with a plurality of extension portions and a plurality of protrusions, the plurality of extension portions are connected to each other as a continuous spiral structure, and the plurality of protrusions extend from the plurality of extension portions; (b) performing an electroforming procedure to form a conductive layer on partial surface of the mold; and (c) stripping the conductive layer from the mold, so as to obtain the conductive winding structure.
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