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    Method for fabrication conductive winding structure
    1.
    发明授权
    Method for fabrication conductive winding structure 有权
    导电绕组结构的制造方法

    公开(公告)号：US08191239B2

    公开(公告)日：2012-06-05

    申请号：US12326242

    申请日：2008-12-02

    申请人： Ming-Tsung Lee ,  Yung-Yu Chang ,  Chen-Yu Yu ,  Jui-Yuan Hsu ,  Chen-Tsai Hsieh

    发明人： Ming-Tsung Lee ,  Yung-Yu Chang ,  Chen-Yu Yu ,  Jui-Yuan Hsu ,  Chen-Tsai Hsieh

    IPC分类号： H01F7/06

    CPC分类号： H01F41/041 ,  H01F17/0033 ,  H01F27/2804 ,  H01F27/2866 ,  H01F29/02 ,  H01F2021/125 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073

    摘要： A conductive winding structure, the fabricating method thereof, and the magnetic device having the same. The method for fabricating the conductive winding structure includes: (a) providing a mold with a plurality of extension portions and a plurality of protrusions, the plurality of extension portions are connected to each other as a continuous spiral structure, and the plurality of protrusions extend from the plurality of extension portions; (b) performing an electroforming procedure to form a conductive layer on partial surface of the mold; and (c) stripping the conductive layer from the mold, so as to obtain the conductive winding structure.

    摘要翻译： 导电绕组结构，其制造方法和具有该导电绕组结构的磁性装置。 制造导电绕组结构的方法包括：（a）提供具有多个延伸部分和多个突起的模具，所述多个延伸部分彼此连接成连续的螺旋结构，并且所述多个突起延伸 从多个延伸部分; （b）进行电铸工序以在模具的局部表面上形成导电层; 和（c）从模具剥离导电层，以获得导电绕组结构。

    ELECTRICAL CONNECTOR WITH MULTIPLE OUTPUTS AND POWER ADAPTER HAVING THE SAME
    4.
    发明申请
    ELECTRICAL CONNECTOR WITH MULTIPLE OUTPUTS AND POWER ADAPTER HAVING THE SAME 审中-公开
    具有多个输出的电气连接器和具有相同功能的电源适配器

    公开(公告)号：US20080050978A1

    公开(公告)日：2008-02-28

    申请号：US11555551

    申请日：2006-11-01

    申请人： Ming-Tsung Lee ,  Jui-Yuan Hsu

    发明人： Ming-Tsung Lee ,  Jui-Yuan Hsu

    IPC分类号： H01R24/04

    CPC分类号： H01R27/00 ,  H01R29/00

    摘要： An electronic connector includes a housing and a plurality of electricity-conducting elements. The housing has a channel therein. The electricity-conducting elements are separated from each other. Each electricity-conducting element includes a first conducting part and a second conducting part. The first conducting part is partially received within the housing and partially exposed to the channel. The second conducting part is extended from the housing. One of the electricity-conducting elements is selected to transmit an output voltage through the first conducting part and the second conducting part of the selected electricity-conducting element.

    摘要翻译： 电子连接器包括壳体和多个导电元件。 外壳内有通道。 导电元件彼此分离。 每个导电元件包括​​第一导电部分和第二导电部分。 第一导电部分部分地容纳在壳体内并且部分地暴露于通道。 第二导电部分从壳体延伸出来。 选择导电元件之一以通过所选择的导电元件的第一导电部分和第二导电部分传输输出电压。

    PROCESS OF FABRICATING STACK COMPONENT
    5.
    发明申请
    PROCESS OF FABRICATING STACK COMPONENT 审中-公开
    制作堆叠组件的过程

    公开(公告)号：US20080210743A1

    公开(公告)日：2008-09-04

    申请号：US11854681

    申请日：2007-09-13

    申请人： Ming-Tsung Lee ,  Chen-Yu Yu ,  Kai-Hung Huang ,  Lin-Hsien Hu

    发明人： Ming-Tsung Lee ,  Chen-Yu Yu ,  Kai-Hung Huang ,  Lin-Hsien Hu

    IPC分类号： B23K1/00 ,  B23K31/02 ,  B29C65/00 ,  H01R43/00

    CPC分类号： H01G4/38 ,  H01G4/232 ,  H05K1/0231 ,  H05K3/305 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T156/10

    摘要： A process of fabricating a stack capacitor includes the following steps. First of all, multiple energy storage units having respective first electrodes and second electrodes at opposite sides are provided. These energy storage units are then stacked to have the first electrodes contact with each other and the second electrodes contact with each other, wherein the energy storage units are initially positioned by a fastening member. Next, the first electrodes are bonded together via a first conductive layer and the second electrodes are bonded together via a second conductive layer, thereby fabricating the stack component.

    摘要翻译： 制造堆叠电容器的工艺包括以下步骤。 首先，设置在相对侧具有各自的第一电极和第二电极的多个储能部。 这些能量存储单元然后被堆叠以使第一电极彼此接触并且第二电极彼此接触，其中能量存储单元最初由紧固构件定位。 接下来，第一电极经由第一导电层接合在一起，并且第二电极经由第二导电层接合在一起，从而制造叠层组件。

    POWER SUPPLY DEVICE WITH PROJECTING FUNCTION
    6.
    发明申请
    POWER SUPPLY DEVICE WITH PROJECTING FUNCTION 审中-公开
    具有投影功能的电源装置

    公开(公告)号：US20110211177A1

    公开(公告)日：2011-09-01

    申请号：US13035684

    申请日：2011-02-25

    申请人： Ming-Tsung Lee ,  Chen-Yu Yu ,  Mao-Hsien Lan ,  Shih-Kai Chien ,  Chin-Tsai Chiang

    发明人： Ming-Tsung Lee ,  Chen-Yu Yu ,  Mao-Hsien Lan ,  Shih-Kai Chien ,  Chin-Tsai Chiang

    IPC分类号： G03B21/14 ,  G03B21/00

    CPC分类号： G03B21/14 ,  G06F1/26 ,  H04M1/0272

    摘要： A power supply device includes a mini projecting module, a power converting module and a signal transmission element. The power converting module includes a power input part, a power converting circuit and a power output part. The power converting circuit is used for converting the input voltage into a first output voltage and a second output voltage. The first output voltage and the second output voltage are respectively transmitted to an electronic device and the mini projecting module. The first output voltage is transmitted to the electronic device through the power output part. The signal transmission element is used for connecting the electronic device or an image signal source with the mini projecting module so that an image signal provided by the electronic device or the image signal source is transmitted to the mini projecting module through the signal transmission element.

    摘要翻译： 电源装置包括迷你投影模块，电力转换模块和信号传输元件。 电力转换模块包括电力输入部分，电力转换电路和电力输出部分。 功率转换电路用于将输入电压转换为第一输出电压和第二输出电压。 第一输出电压和第二输出电压分别传送到电子设备和迷你投影模块。 第一输出电压通过功率输出部分传输到电子设备。 信号传输元件用于将电子设备或图像信号源与迷你投影模块连接，使得由电子设备或图像信号源提供的图像信号通过信号传输元件传输到迷你投影模块。

    HIGH VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR DEVICE
    7.
    发明申请
    HIGH VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR DEVICE 审中-公开
    高电压金属氧化物半导体晶体管器件

    公开(公告)号：US20130320445A1

    公开(公告)日：2013-12-05

    申请号：US13487268

    申请日：2012-06-04

    申请人： Ming-Tsung Lee ,  Cheng-Hua Yang ,  Shih-Chieh Pu ,  Wen-Fang Lee ,  Chih-Chung Wang

    发明人： Ming-Tsung Lee ,  Cheng-Hua Yang ,  Shih-Chieh Pu ,  Wen-Fang Lee ,  Chih-Chung Wang

    IPC分类号： H01L29/78

    CPC分类号： H01L29/0878 ,  H01L29/0634 ,  H01L29/0696 ,  H01L29/404 ,  H01L29/42368 ,  H01L29/7816

    摘要： A high voltage metal-oxide-semiconductor (HV MOS) device includes a substrate, a gate positioned on the substrate, a drain region formed in the substrate, a source region formed in the substrate, a first doped region formed in between the drain region and the source region, and a second doped region formed over a top of the first doped region or/and under a bottom of the first doped region. The drain region, the source region, and the second doped region include a first conductivity type, the first doped region includes a second conductivity type, and the first conductivity type and the second conductivity type are complementary.

    摘要翻译： 高压金属氧化物半导体（HV MOS）器件包括衬底，位于衬底上的栅极，形成在衬底中的漏极区，形成在衬底中的源极区，形成在漏极区之间的第一掺杂区 和源极区，以及形成在第一掺杂区的顶部或/或第一掺杂区的底部下方的第二掺杂区。 漏极区域，源极区域和第二掺杂区域包括第一导电类型，第一掺杂区域包括第二导电类型，并且第一导电类型和第二导电类型是互补的。

    SOCKET TERMINAL HEAT-DISSIPATING MECHANISM
    8.
    发明申请
    SOCKET TERMINAL HEAT-DISSIPATING MECHANISM 有权
    插座端子热释放机构

    公开(公告)号：US20110143580A1

    公开(公告)日：2011-06-16

    申请号：US12957338

    申请日：2010-11-30

    申请人： Ming-Tsung Lee ,  Yu-Chi Jen

    发明人： Ming-Tsung Lee ,  Yu-Chi Jen

    IPC分类号： H01R13/00 ,  H05K7/20

    CPC分类号： H05K7/20445

    摘要： A socket terminal heat-dissipating mechanism is provided for use in an electronic device. The electronic device includes a frame and a casing. The socket terminal heat-dissipating mechanism includes a socket and an insulating layer. The socket is mounted in the frame of the electronic device, and includes a contact terminal. The insulating layer is arranged between the contact terminal and the casing of the electronic device, wherein heat energy is conducted from the contact terminal of the socket to the casing through the insulating layer, and passively dissipated away.

    摘要翻译： 提供一种用于电子设备的插座端子散热机构。 电子设备包括框架和壳体。 插座端子散热机构包括插座和绝缘层。 插座安装在电子设备的框架中，并且包括接触端子。 绝缘层设置在电子设备的接触端子和壳体之间，其中热能通过绝缘层从插座的接触端子传导到壳体，并被动地消散。

    HIGH VOLTAGE DEVICE AND METHOD OF FABRICATING THE SAME
    9.
    发明申请
    HIGH VOLTAGE DEVICE AND METHOD OF FABRICATING THE SAME 有权
    高电压装置及其制造方法

    公开(公告)号：US20090065879A1

    公开(公告)日：2009-03-12

    申请号：US11853499

    申请日：2007-09-11

    申请人： Yun-Han Ma ,  Ming-Tsung Lee ,  Shih-Ming Liang ,  Hwi-Huang Chen

    发明人： Yun-Han Ma ,  Ming-Tsung Lee ,  Shih-Ming Liang ,  Hwi-Huang Chen

    IPC分类号： H01L29/94 ,  H01L21/336

    CPC分类号： H01L29/513 ,  H01L21/28167 ,  H01L29/0653 ,  H01L29/4908

    摘要： A high voltage device is provided. The high voltage device includes a gate on a substrate, two source/drain regions in the substrate beside the gate, and a composite gate dielectric layer that includes at least two stacked continuous layers, extending from one side to another side of the gate. Wherein, the at least two stacked continuous layers is a combination of at least one thermal oxide layer and at least one chemical vapor deposited layer.

    摘要翻译： 提供高压装置。 高电压器件包括衬底上的栅极，栅极旁边的衬底中的两个源极/漏极区域和复合栅极电介质层，其包括从栅极的一侧延伸到另一侧的至少两个层叠的连续层。 其中，所述至少两个堆叠的连续层是至少一个热氧化物层和至少一个化学气相沉积层的组合。

    Stacked electronic component and fastening device thereof
    10.
    发明授权
    Stacked electronic component and fastening device thereof 有权
    堆叠电子部件及其紧固装置

    公开(公告)号：US07331799B1

    公开(公告)日：2008-02-19

    申请号：US11626985

    申请日：2007-01-25

    申请人： Ming-Tsung Lee

    发明人： Ming-Tsung Lee

    IPC分类号： H01R12/00

    CPC分类号： H05K3/301 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10515 ,  H05K2201/10636 ,  Y02P70/611

    摘要： A stacked electronic component includes multiple energy storage units and a fastening device. Each energy storage unit has a first electrode and a second electrode. The fastening device includes first and second fastening member disposed on opposite sides of the energy storage units. Each of the first and second fastening members includes a body plate, at least a clamping structure extending from two edges of the body plate and at least a connecting part electrically connected to the body plate and the circuit board. The energy storage units are clamped by the clamping structures of the first and second fastening members and the first and second electrodes are electrically connected to the body plates of the first and second fastening members, so that the first and second electrodes are electrically connected to the circuit board through the body plates and the connecting parts of the first and second fastening members.

    摘要翻译： 堆叠的电子部件包括多个能量存储单元和紧固装置。 每个能量存储单元具有第一电极和第二电极。 紧固装置包括设置在能量存储单元的相对侧上的第一和第二紧固构件。 第一和第二紧固构件中的每一个包括主体板，至少一个从主体板的两个边缘延伸的夹持结构和至少一个电连接到主体板和电路板的连接部分。 能量存储单元由第一和第二紧固构件的夹持结构夹持，并且第一和第二电极电连接到第一和第二紧固构件的主体板，使得第一和第二电极电连接到 电路板通过主体板和第一和第二紧固构件的连接部分。