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US08193637B2 Semiconductor package and multi-chip package using the same 有权
半导体封装和多芯片封装使用相同

Semiconductor package and multi-chip package using the same
摘要：
A semiconductor package may have a semiconductor chip that includes a chip pad formed on a substrate including an integrated circuit, and a passivation layer exposing the chip pad, a first redistribution wiring layer that is connected to the chip pad and extends on the semiconductor chip and includes a wire bonding pad to provide wire bonding and a first solder pad to connect the first redistribution wiring layer to a second semiconductor chip, and a second redistribution wiring layer that is connected to the first redistribution wiring layer on the first redistribution wiring layer and includes a second solder pad to connect the second redistribution wiring layer to a third semiconductor chip.
摘要（中）：

半导体封装可以具有半导体芯片，其包括形成在包括集成电路的基板上的芯片焊盘和暴露芯片焊盘的钝化层，连接到芯片焊盘并在半导体芯片上延伸的第一再分配布线层，以及 包括用于提供引线接合的引线接合焊盘和将第一再分配布线层连接到第二半导体芯片的第一焊盘，以及连接到第一再分布布线层上的第一再分布布线层的第二再分布布线层， 第二焊盘，用于将第二再分配布线层连接到第三半导体芯片。

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