公开(公告)号：US08193637B2

公开(公告)日：2012-06-05

申请号：US12193835

申请日：2008-08-19

申请人： Myeong-soon Park ,  Hyun-soo Chung ,  Seok-ho Kim ,  Ki-hyuk Kim ,  Chang-woo Shin

发明人： Myeong-soon Park ,  Hyun-soo Chung ,  Seok-ho Kim ,  Ki-hyuk Kim ,  Chang-woo Shin

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/731 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may have a semiconductor chip that includes a chip pad formed on a substrate including an integrated circuit, and a passivation layer exposing the chip pad, a first redistribution wiring layer that is connected to the chip pad and extends on the semiconductor chip and includes a wire bonding pad to provide wire bonding and a first solder pad to connect the first redistribution wiring layer to a second semiconductor chip, and a second redistribution wiring layer that is connected to the first redistribution wiring layer on the first redistribution wiring layer and includes a second solder pad to connect the second redistribution wiring layer to a third semiconductor chip.

摘要翻译： 半导体封装可以具有半导体芯片，其包括形成在包括集成电路的基板上的芯片焊盘和暴露芯片焊盘的钝化层，连接到芯片焊盘并在半导体芯片上延伸的第一再分配布线层，以及 包括用于提供引线接合的引线接合焊盘和将第一再分配布线层连接到第二半导体芯片的第一焊盘，以及连接到第一再分布布线层上的第一再分布布线层的第二再分布布线层， 第二焊盘，用于将第二再分配布线层连接到第三半导体芯片。

公开(公告)号：US07969024B2

公开(公告)日：2011-06-28

申请号：US12453103

申请日：2009-04-29

申请人： Hyun-soo Chung ,  Jae-shin Cho ,  Seong-deok Hwang ,  Jum-gon Kim ,  Ki-hyuk Kim

发明人： Hyun-soo Chung ,  Jae-shin Cho ,  Seong-deok Hwang ,  Jum-gon Kim ,  Ki-hyuk Kim

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49811 ,  H01L23/525 ,  H01L23/53252 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/325 ,  H05K2201/10348 ,  H05K2201/10977 ,  H01L2924/00014

摘要： A semiconductor package with improved joint reliability and a method of fabricating the semiconductor package are disclosed. A conductive connector may be formed on a surface of a semiconductor wafer on which semiconductor devices may be arranged. A first insulating layer including a first opening through which a portion of the connection pad is exposed may be formed on the connection pad and the semiconductor wafer. A rewiring line electrically connected to an exposed portion of the connection pad may be formed on the first insulating layer. A second insulating layer including a second opening through which a portion of the rewiring line is exposed may be formed on the rewiring line and the first insulating layer. A connection terminal including one or more entangled wires may be formed on an exposed portion of the rewiring line so as to be electrically connected to the rewiring line.

摘要翻译： 公开了一种具有改进的接头可靠性的半导体封装以及制造半导体封装的方法。 可以在其上可以布置半导体器件的半导体晶片的表面上形成导电连接器。 包括连接焊盘的一部分露出的第一开口的第一绝缘层可以形成在连接焊盘和半导体晶片上。 电连接到连接焊盘的暴露部分的再布线可以形成在第一绝缘层上。 可以在重新配线和第一绝缘层上形成第二绝缘层，该第二绝缘层包括第二开口，重新布线的一部分暴露在第二开口中。 包括一个或多个缠结线的连接端子可以形成在重新布线的暴露部分上，以便电连接到重新布线。

公开(公告)号：US20090315177A1

公开(公告)日：2009-12-24

申请号：US12453103

申请日：2009-04-29

申请人： Hyun-soo Chung ,  Jae-shin Cho ,  Seong-deok Hwang ,  Jum-gon Kim ,  Ki-hyuk Kim

发明人： Hyun-soo Chung ,  Jae-shin Cho ,  Seong-deok Hwang ,  Jum-gon Kim ,  Ki-hyuk Kim

IPC分类号： H01L23/498

CPC分类号： H01L23/49811 ,  H01L23/525 ,  H01L23/53252 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/325 ,  H05K2201/10348 ,  H05K2201/10977 ,  H01L2924/00014

摘要： A semiconductor package with improved joint reliability and a method of fabricating the semiconductor package are disclosed. A conductive connector may be formed on a surface of a semiconductor wafer on which semiconductor devices may be arranged. A first insulating layer including a first opening through which a portion of the connection pad is exposed may be formed on the connection pad and the semiconductor wafer. A rewiring line electrically connected to an exposed portion of the connection pad may be formed on the first insulating layer. A second insulating layer including a second opening through which a portion of the rewiring line is exposed may be formed on the rewiring line and the first insulating layer. A connection terminal including one or more entangled wires may be formed on an exposed portion of the rewiring line so as to be electrically connected to the rewiring line.

摘要翻译： 公开了一种具有改进的接头可靠性的半导体封装以及制造半导体封装的方法。 可以在其上可以布置半导体器件的半导体晶片的表面上形成导电连接器。 包括连接焊盘的一部分露出的第一开口的第一绝缘层可以形成在连接焊盘和半导体晶片上。 电连接到连接焊盘的暴露部分的再布线可以形成在第一绝缘层上。 可以在重新配线和第一绝缘层上形成第二绝缘层，该第二绝缘层包括第二开口，重新布线的一部分暴露在第二开口中。 包括一个或多个缠结线的连接端子可以形成在重新布线的暴露部分上，以便电连接到重新布线。