Invention Grant
- Patent Title: Optimization of metallurgical properties of a solder joint
- Patent Title (中): 优化焊点的冶金特性
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Application No.: US12111524Application Date: 2008-04-29
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Publication No.: US08197612B2Publication Date: 2012-06-12
- Inventor: James A Busby , Minhua Lu , Valerie A Oberson , Eric D Perfecto , Kamalesh K Srivastava , Brian R Sundlof , Julien Sylvestre , Renee L Weisman
- Applicant: James A Busby , Minhua Lu , Valerie A Oberson , Eric D Perfecto , Kamalesh K Srivastava , Brian R Sundlof , Julien Sylvestre , Renee L Weisman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Joe Petrokaitis
- Main IPC: B23K35/22
- IPC: B23K35/22
Abstract:
Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.
Public/Granted literature
- US20090266447A1 OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT Public/Granted day:2009-10-29
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