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公开(公告)号：US20090057865A1
公开(公告)日：2009-03-05
申请号：US11847606
申请日：2007-08-30
Applicant: William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , David L. Questad , Robin A. Susko
Inventor： William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , David L. Questad , Robin A. Susko
CPC classification number: H01L23/3121 , H01L23/4006 , H01L23/42 , H01L23/49827 , H01L23/5385 , H01L2023/4081 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/19041 , H01L2924/3011 , H01L2224/05599
Abstract: An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers. The load-distributing material comprises a rigid material incased in a compressible material.
Abstract translation: 提供LGA结构，其具有在衬底上的至少一个半导体器件和半导体器件上的机械负载设备。 该结构包括在机械负载装置和基板之间的负载分配材料。 具体地，负载分布材料靠近半导体器件的第一侧，并且半导体器件的与半导体器件的第一侧相对的第二侧。 此外，负载分布材料完全围绕半导体器件并接触机械负载装置，衬底和半导体器件。 载荷分布材料可以是导热的并且包括弹性体和/或液体。 负载分配材料包括适于将衬底连接到衬底下面的PCB和/或第二衬底的LGA插入器。 此外，载荷分布材料包括可压缩材料层和刚性材料层。 载荷分配材料包括浸在可压缩材料中的刚性材料。
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公开(公告)号：US06848914B2
公开(公告)日：2005-02-01
申请号：US09975213
申请日：2001-10-11
Applicant: Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
Inventor： Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
CPC classification number: H01R43/007 , H01R12/52 , H01R13/2421
Abstract: A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.
Abstract translation: 用于电耦合两个基板（例如，印刷线路板和电子模块）的结构和方法。 首先，提供介质芯。 导电布线围绕介质芯螺旋缠绕。 此外，可以在导电布线周围形成电介质护套。 所得的导电杆结构沿着导电棒的长度被轴向地切割，以产生具有端部触头的导电按钮。 导电按钮的端部触点可用于将两个基板电耦合到两个基板的相应焊盘处。
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公开(公告)号：US07255571B2
公开(公告)日：2007-08-14
申请号：US11521158
申请日：2006-09-14
Applicant: William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , Robin A. Susko , James R. Wilcox
Inventor： William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , Robin A. Susko , James R. Wilcox
IPC: H01R12/00
CPC classification number: H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/0501 , H01L2224/05011 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/30107 , H01R4/01 , H01R12/52 , H05K3/325 , H05K2201/068 , H05K2201/209 , H05K2203/1105 , H01L2224/05099
Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
Abstract translation: 公开了一种用于形成用于半导体封装的可移除互连的方法和结构，其中连接器适于在经受温度变化时从第一形状重复地变为第二形状，并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时，连接器可以断开，并且当连接器处于其第一形状时连接器不能断开。
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公开(公告)号：US07128579B1
公开(公告)日：2006-10-31
申请号：US11161858
申请日：2005-08-19
Applicant: William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , Robin A. Susko , James R. Wilcox
Inventor： William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , Robin A. Susko , James R. Wilcox
IPC: H01R12/00
CPC classification number: H01R12/523 , H01R12/58 , Y10S439/907 , Y10S439/908
Abstract: Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are adapted to allow a press-fit connection with the walls of the plated through holes of either one or both of the semiconductor module and the substrate. The hook-shaped ends of the pins may have one or more hooks to establish the connection. Additionally, the pins may be formed of a temperature induced shape change material that bends to allow engaging and/or disengaging of the hook-shaped ends from the walls of the plated through holes.
Abstract translation: 公开了一种半导体封装结构，其结合使用导电引脚来电和机械地连接半导体模块和基板（例如，印刷线路板）。 具体地，销的一端或两端被钩住并且适于允许与半导体模块和衬底中的一个或两者的电镀通孔的壁压合连接。 销的钩形端可以具有一个或多个钩以建立连接。 此外，销可以由温度诱导的形状变化材料形成，该材料弯曲以允许钩状端部与电镀通孔的壁接合和/或脱离。
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公开(公告)号：US20080225484A1
公开(公告)日：2008-09-18
申请号：US11687037
申请日：2007-03-16
Applicant: William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
Inventor： William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
IPC: H05K7/20
CPC classification number: H01L23/42 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511 , H01L2224/0401
Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.
Abstract translation: 使用柔性热枕头增强电子部件传热的方法，装置和组件。 柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。 枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。 在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。 在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。 外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。
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Patent Agency Ranking
公开(公告)号：US07795724B2
公开(公告)日：2010-09-14
申请号：US11847606
申请日：2007-08-30
Applicant: William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , David L. Questad , Robin A. Susko
Inventor： William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , David L. Questad , Robin A. Susko
IPC: H01L23/34
CPC classification number: H01L23/3121 , H01L23/4006 , H01L23/42 , H01L23/49827 , H01L23/5385 , H01L2023/4081 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/19041 , H01L2924/3011 , H01L2224/05599
Abstract: An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers. The load-distributing material comprises a rigid material incased in a compressible material.
Abstract translation: 提供LGA结构，其具有在衬底上的至少一个半导体器件和半导体器件上的机械负载设备。 该结构包括在机械负载装置和基板之间的负载分配材料。 具体地，负载分布材料靠近半导体器件的第一侧，并且半导体器件的与半导体器件的第一侧相对的第二侧。 此外，负载分布材料完全围绕半导体器件并接触机械负载装置，衬底和半导体器件。 载荷分布材料可以是导热的并且包括弹性体和/或液体。 负载分配材料包括适于将衬底连接到衬底下面的PCB和/或第二衬底的LGA插入器。 此外，载荷分布材料包括可压缩材料层和刚性材料层。 载荷分配材料包括浸在可压缩材料中的刚性材料。
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公开(公告)号：US07709951B2
公开(公告)日：2010-05-04
申请号：US11687037
申请日：2007-03-16
Applicant: William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin, IV , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
Inventor： William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin, IV , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
IPC: H01L23/34 , H01L23/495 , H01L23/48
CPC classification number: H01L23/42 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511 , H01L2224/0401
Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.
Abstract translation: 使用柔性热枕头增强电子部件传热的方法，装置和组件。 柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。 枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。 在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。 在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。 外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。
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公开(公告)号：US07137826B2
公开(公告)日：2006-11-21
申请号：US10906810
申请日：2005-03-08
Applicant: William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , Robin A. Susko , James R. Wilcox
Inventor： William L. Brodsky , James A. Busby , Bruce J. Chamberlin , Mitchell G. Ferrill , Robin A. Susko , James R. Wilcox
IPC: H01R12/00
CPC classification number: H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/0501 , H01L2224/05011 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/30107 , H01R4/01 , H01R12/52 , H05K3/325 , H05K2201/068 , H05K2201/209 , H05K2203/1105 , H01L2224/05099
Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
Abstract translation: 公开了一种用于形成用于半导体封装的可移除互连的方法和结构，其中连接器适于在经受温度变化时从第一形状重复地变为第二形状，并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时，连接器可以断开，并且当连接器处于其第一形状时连接器不能断开。
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公开(公告)号：US08197612B2
公开(公告)日：2012-06-12
申请号：US12111524
申请日：2008-04-29
Applicant: James A Busby , Minhua Lu , Valerie A Oberson , Eric D Perfecto , Kamalesh K Srivastava , Brian R Sundlof , Julien Sylvestre , Renee L Weisman
Inventor： James A Busby , Minhua Lu , Valerie A Oberson , Eric D Perfecto , Kamalesh K Srivastava , Brian R Sundlof , Julien Sylvestre , Renee L Weisman
IPC: B23K35/22
CPC classification number: B23K35/262 , B23K2101/36
Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.
Abstract translation: 提供半导体封装技术，其使用不同的焊料优化接头的冶金性能。 用于受控塌陷芯片连接处理的焊料组合物包括为芯片设计的锡基无铅焊料组分和为层压板设计的第二焊料组分的组合。 回流后模块Ag的总浓度小于1.9重量％。 还提供了制造焊料组分的方法。
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公开(公告)号：US20090266447A1
公开(公告)日：2009-10-29
申请号：US12111524
申请日：2008-04-29
Applicant: JAMES A. BUSBY , MINHUA LU , VALERIE A. OBERSON , ERIC D. PERFECTO , KAMALESH K. SRIVASTAVA , BRIAN R. SUNDLOF , JULIEN SYLVESTRE , RENEE L. WEISMAN
Inventor： JAMES A. BUSBY , MINHUA LU , VALERIE A. OBERSON , ERIC D. PERFECTO , KAMALESH K. SRIVASTAVA , BRIAN R. SUNDLOF , JULIEN SYLVESTRE , RENEE L. WEISMAN
IPC: B23K35/22
CPC classification number: B23K35/262 , B23K2101/36
Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.
Abstract translation: 提供半导体封装技术，其使用不同的焊料优化接头的冶金性能。 用于受控塌陷芯片连接处理的焊料组合物包括为芯片设计的锡基无铅焊料组分和为层压板设计的第二焊料组分的组合。 回流后模块Ag的总浓度小于1.9重量％。 还提供了制造焊料组分的方法。
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