Invention Grant
US08202393B2 Alternate gas delivery and evacuation system for plasma processing apparatuses
有权
用于等离子体处理装置的替代气体输送和抽空系统
- Patent Title: Alternate gas delivery and evacuation system for plasma processing apparatuses
- Patent Title (中): 用于等离子体处理装置的替代气体输送和抽空系统
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Application No.: US12230089Application Date: 2008-08-22
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Publication No.: US08202393B2Publication Date: 2012-06-19
- Inventor: Harry P. Wong , Vernon Wong , Christopher Charles Griffin , Mark Taskar
- Applicant: Harry P. Wong , Vernon Wong , Christopher Charles Griffin , Mark Taskar
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C16/00 ; C23C14/00

Abstract:
A gas distribution system for supplying a gas mixture to a plasma process chamber is provided. A first valve arrangement is connected to upstream ends of a first gas line and a second gas line. A second valve arrangement is connected to downstream ends of the first gas line and the second gas line. A first gas distribution outlet line is connected between a gas supply and the first valve arrangement and a first chamber inlet line connected between the second valve arrangement and the plasma process chamber. A first evacuation line is connected to the first gas line at a location between the first valve arrangement and the second valve arrangement. A second evacuation line is connected to the second gas line at a location between the first valve arrangement and the second valve arrangement. The first evacuation line and second evacuation line are in fluid communication with a vacuum line. A controller is operable to actuate the first valve arrangement and second valve arrangement to selectively flow the gas mixture from the gas supply to the plasma process chamber through the first gas line while the second gas is selectively evacuated by the vacuum line; or to selectively flow the gas mixture from the gas supply to the plasma process chamber through the second gas line while the first gas line is selectively evacuated by the vacuum line.
Public/Granted literature
- US20090061640A1 Alternate gas delivery and evacuation system for plasma processing apparatuses Public/Granted day:2009-03-05
Information query
IPC分类: