Invention Grant
US08211540B2 Adhesive film composition, associated dicing die bonding film, die package, and associated methods
有权
粘合膜组合物，相关切割芯片接合薄膜，模具包装及相关方法
- Patent Title: Adhesive film composition, associated dicing die bonding film, die package, and associated methods
- Patent Title (中): 粘合膜组合物，相关切割芯片接合薄膜，模具包装及相关方法
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Application No.: US12285568Application Date: 2008-10-08
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Publication No.: US08211540B2Publication Date: 2012-07-03
- Inventor: Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
- Applicant: Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
- Applicant Address: KR Gumi-si, Gyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Gyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2007-0100947 20071008
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B27/26 ; C08L13/00 ; C08L15/00 ; C08L63/00 ; H01L23/02 ; H01L21/00
Abstract:
An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.
Public/Granted literature
- US20090110940A1 Adhesive film composition, associated dicing die bonding film, die package, and associated methods Public/Granted day:2009-04-30
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