Invention Grant
US08237279B2 Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate
有权
将半导体管芯连接到半导体芯片封装衬底的锡球周围的环形结构
- Patent Title: Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate
- Patent Title (中): 将半导体管芯连接到半导体芯片封装衬底的锡球周围的环形结构
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Application No.: US12879602Application Date: 2010-09-10
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Publication No.: US08237279B2Publication Date: 2012-08-07
- Inventor: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sullivan
- Applicant: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sullivan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent David A. Cain
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
In one embodiment, a collar structure includes a non-conductive layer that relieves stress around the perimeter of each of the solder balls that connect the semiconductor die to the semiconductor chip package substrate, and another non-conductive layer placed underneath to passivate the entire surface of the die.
Public/Granted literature
Information query
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