Invention Grant
- Patent Title: Optical wiring board and manufacturing method thereof
- Patent Title (中): 光接线板及其制造方法
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Application No.: US12761716Application Date: 2010-04-16
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Publication No.: US08249403B2Publication Date: 2012-08-21
- Inventor: Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
- Applicant: Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2009-0109767 20091113
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/10

Abstract:
An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.
Public/Granted literature
- US20110116737A1 OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-05-19
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