发明授权
- 专利标题: Etchant and method of manufacturing an array substrate using the same
- 专利标题(中): 蚀刻剂和使用其制造阵列基板的方法
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申请号: US12777532申请日: 2010-05-11
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公开(公告)号: US08262928B2公开(公告)日: 2012-09-11
- 发明人: Bong-Kyun Kim , Jong-Hyun Choung , Byeong-Jin Lee , Sun-Young Hong , Hong-Sick Park , Shi-Yul Kim , Ki-Beom Lee , Sam-Young Cho , Sang-Woo Kim , Hyun-Cheol Shin , Won-Guk Seo
- 申请人: Bong-Kyun Kim , Jong-Hyun Choung , Byeong-Jin Lee , Sun-Young Hong , Hong-Sick Park , Shi-Yul Kim , Ki-Beom Lee , Sam-Young Cho , Sang-Woo Kim , Hyun-Cheol Shin , Won-Guk Seo
- 申请人地址: KR Suwon-Si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si
- 代理机构: F. Chau & Associates, LLC
- 优先权: KR2009-0042173 20090514
- 主分类号: H01L33/44
- IPC分类号: H01L33/44 ; C09K13/08
摘要:
An etchant includes about 0.1 percent by weight to about 30 percent by weight of ammonium persulfate (NH4)2S2O8, about 0.1 percent by weight to about 10 percent by weight of an inorganic acid, about 0.1 percent by weight to about 10 percent by weight of an acetate salt, about 0.01 percent by weight to about 5 percent by weight of a fluorine-containing compound, about 0.01 percent by weight to about 5 percent by weight of a sulfonic acid compound, about 0.01 percent by weight to about 2 percent by weight of an azole compound, and a remainder of water. Accordingly, the etchant may have high stability to maintain etching ability. Thus, manufacturing margins may be improved so that manufacturing costs may be reduced.
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