发明授权
- 专利标题： Process for fabricating micromachine
- 专利标题（中）： 微机械制造工艺
-
申请号： US10551271申请日： 2004-04-02
-
公开(公告)号： US08268660B2公开(公告)日： 2012-09-18
- 发明人: Masahiro Tada , Takashi Kinoshita , Masahiro Tanaka , Masanari Yamaguchi , Shun Mitarai , Koji Naniwada
- 申请人： Masahiro Tada , Takashi Kinoshita , Masahiro Tanaka , Masanari Yamaguchi , Shun Mitarai , Koji Naniwada
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： SNR Denton US LLP
- 优先权： JPP2003-098782 20030402; JP2004-068325 20040311
- 国际申请： PCT/JP2004/004822 WO 20040402
- 国际公布： WO2004/089812 WO 20041021
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method for manufacturing a micromachine is provided which can remove a sacrifice layer and can perform sealing without using a specific packaging technique. In a method for manufacturing a micromachine (1) including an oscillator (4), a step of forming a sacrifice layer around a movable portion of the oscillator (4); a step of covering a sacrifice layer with an overcoat film (8), followed by the formation of a penetrating hole (10) reaching the sacrifice layer in the overcoat layer (8); a step of performing sacrifice-layer etching for removing the sacrifice layer using the penetrating hole (10) in order to form a space around the movable portion; and a step of performing a film-formation treatment at a reduced pressure following the sacrifice-layer etching so as to seal the penetrating hole (10).
公开/授权文献
- US20060216847A1 Process for fabricating micromachine 公开/授权日：2006-09-28
信息查询
IPC分类:
