Invention Grant
- Patent Title: Multi-core processor and method of communicating across a die
- Patent Title (中): 多核处理器和跨模块通信的方法
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Application No.: US11966327Application Date: 2007-12-28
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Publication No.: US08284766B2Publication Date: 2012-10-09
- Inventor: Mark Anders , Himanshu Kaul , Ram Krishnamurthy , Shekhar Borkar
- Applicant: Mark Anders , Himanshu Kaul , Ram Krishnamurthy , Shekhar Borkar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: KED & Associates, LLP
- Main IPC: H04L12/66
- IPC: H04L12/66
Abstract:
A multi-core die is provided that allows packets to be communicated across the die using resources of a packet switched network and a circuit switched network.
Public/Granted literature
- US20090168767A1 MULTI-CORE PROCESSOR AND METHOD OF COMMUNICATING ACROSS A DIE Public/Granted day:2009-07-02
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