Invention Grant
- Patent Title: Semiconductor package and method for manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US12461456Application Date: 2009-08-12
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Publication No.: US08304876B2Publication Date: 2012-11-06
- Inventor: Hak-Kyoon Byun , Taehoon Kim , Jongkook Kim , Sang-Uk Han , Jung-Do Lee , Seonhyang You
- Applicant: Hak-Kyoon Byun , Taehoon Kim , Jongkook Kim , Sang-Uk Han , Jung-Do Lee , Seonhyang You
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0079573 20080813
- Main IPC: H01L25/11
- IPC: H01L25/11
Abstract:
Provided is a semiconductor package and a method for fabricating the semiconductor package. The semiconductor package may include a first package having a first semiconductor chip mounted on a first substrate and a second package having a second semiconductor chip mounted on a second substrate, the second substrate being bent to cover a side of the first package to contact the first substrate such that the first and second packages are connected electrically.
Public/Granted literature
- US20100038765A1 Semiconductor package and method for manufacturing the same Public/Granted day:2010-02-18
Information query
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