发明授权
- 专利标题： Polishing pad
- 专利标题（中）： 抛光垫
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申请号： US12065219申请日： 2006-08-22
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公开(公告)号： US08309466B2公开(公告)日： 2012-11-13
- 发明人: Kazuyuki Ogawa , Tetsuo Shimomura , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
- 申请人： Kazuyuki Ogawa , Tetsuo Shimomura , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
- 申请人地址： JP Osaka-shi
- 专利权人： Toyo Tire & Rubber Co., Ltd.
- 当前专利权人： Toyo Tire & Rubber Co., Ltd.
- 当前专利权人地址： JP Osaka-shi
- 代理机构： Morrison & Foerster LLP
- 优先权： JP2005-249046 20050830
- 国际申请： PCT/JP2006/316372 WO 20060822
- 国际公布： WO2007/026569 WO 20070308
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/461 ; B32B5/00 ; B32B3/26
摘要：
A polishing pad has an excellent polishing rate and is superior in longevity without generating center slow. A method of manufacturing a semiconductor device with the polishing pad is also provided. The polishing pad has a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.
公开/授权文献
- US20090104850A1 POLISHING PAD 公开/授权日：2009-04-23
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