Invention Grant
- Patent Title: Inspecting method and inspecting apparatus for substrate surface
- Patent Title (中): 基板表面检查方法及检查装置
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Application No.: US13404749Application Date: 2012-02-24
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Publication No.: US08310665B2Publication Date: 2012-11-13
- Inventor: Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- Applicant: Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-134945 20080523; JP2008-263397 20081010
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
An inspecting method and apparatus for inspecting a substrate surface includes application of a light to the substrate surface, detection of scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals, extraction of a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculation of a value regarding a state of film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
Public/Granted literature
- US20120162665A1 Inspecting Method and Inspecting Apparatus for Substrate Surface Public/Granted day:2012-06-28
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