发明授权
US08313960B1 Magnetic tunnel junction (MTJ) formation using multiple etching processes
有权
使用多次蚀刻工艺形成磁隧道结(MTJ)
- 专利标题: Magnetic tunnel junction (MTJ) formation using multiple etching processes
- 专利标题(中): 使用多次蚀刻工艺形成磁隧道结(MTJ)
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申请号: US13371380申请日: 2012-02-10
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公开(公告)号: US08313960B1公开(公告)日: 2012-11-20
- 发明人: Ebrahim Abedifard , Parviz Keshtbod
- 申请人: Ebrahim Abedifard , Parviz Keshtbod
- 申请人地址: US CA Fremont
- 专利权人: Avalanche Technology, Inc.
- 当前专利权人: Avalanche Technology, Inc.
- 当前专利权人地址: US CA Fremont
- 代理机构: IPxLaw Group LLP
- 代理商 Maryam Imam
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method of manufacturing a magnetic memory element includes the steps of forming a permanent magnetic layer on top a bottom electrode, forming a pinning layer on top the permanent magnetic layer, forming a magnetic tunnel junction (MTJ) including a barrier layer on top of the pinning layer, forming a top electrode on top of the MTJ, forming a hard mask on top of the top electrode, and using the hard mask to perform a series of etching processes to reduce the width of the MTJ and the top electrode to substantially a desired width, where one of these etching processes is stopped when a predetermined material in the pinning layer is detected thereby avoiding deposition of metal onto the barrier layer of the etching process thereby preventing shorting.
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