Invention Grant
- Patent Title: Dimensionally decoupled ball limiting metalurgy
- Patent Title (中): 尺寸分离球限制冶金
-
Application No.: US12897826Application Date: 2010-10-05
-
Publication No.: US08338286B2Publication Date: 2012-12-25
- Inventor: Eric David Perfecto , Harry David Cox , Timothy Harrison Daubenspeck , David L. Questad , Brian Richard Sundlof
- Applicant: Eric David Perfecto , Harry David Cox , Timothy Harrison Daubenspeck , David L. Questad , Brian Richard Sundlof
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Howard M. Cohn; Katherine S. Brown
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method for reducing stress on under ball metallurgy (UBM) is disclosed. A collar is disposed around the ball to provide support, and prevent solder interaction in the undercut areas of the UBM. In one embodiment, the collar is comprised of photosensitive polyimide.
Public/Granted literature
- US20120083114A1 DIMENSIONALLY DECOUPLED BALL LIMITING METALURGY Public/Granted day:2012-04-05
Information query
IPC分类:
