公开(公告)号：US08338286B2

公开(公告)日：2012-12-25

申请号：US12897826

申请日：2010-10-05

Applicant: Eric David Perfecto ,  Harry David Cox ,  Timothy Harrison Daubenspeck ,  David L. Questad ,  Brian Richard Sundlof

Inventor： Eric David Perfecto ,  Harry David Cox ,  Timothy Harrison Daubenspeck ,  David L. Questad ,  Brian Richard Sundlof

IPC: H01L21/44

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/0219 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05562 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00015 ,  H01L2924/01074 ,  H01L2924/06 ,  H01L2924/053 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method for reducing stress on under ball metallurgy (UBM) is disclosed. A collar is disposed around the ball to provide support, and prevent solder interaction in the undercut areas of the UBM. In one embodiment, the collar is comprised of photosensitive polyimide.

Abstract translation: 公开了一种减少球磨冶金（UBM）应力的方法。 围绕球设置套环以提供支撑，并且防止UBM的底切区域中的焊料相互作用。 在一个实施例中，套环由光敏聚酰亚胺组成。