发明授权
- 专利标题： Surface processing method for mounting stage
- 专利标题（中）： 表面处理方法安装阶段
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申请号： US12057975申请日： 2008-03-28
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公开(公告)号： US08343372B2公开(公告)日： 2013-01-01
- 发明人: Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
- 申请人： Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2007-092378 20070330
- 主分类号： B29C61/04
- IPC分类号： B29C61/04 ; H05H1/00
摘要：
A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.
公开/授权文献
- US20080237030A1 SURFACE PROCESSING METHOD FOR MOUNTING STAGE 公开/授权日：2008-10-02
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