Invention Grant
- Patent Title: SCR/MOS clamp for ESD protection of integrated circuits
- Patent Title (中): 用于集成电路ESD保护的SCR / MOS钳位
-
Application No.: US13149174Application Date: 2011-05-31
-
Publication No.: US08354722B2Publication Date: 2013-01-15
- Inventor: John B. Campi, Jr. , Shunhua Chang , Kiran V. Chatty , Robert J. Gauthier, Jr. , Junjun Li , Rahul Mishra , Mujahid Muhammad
- Applicant: John B. Campi, Jr. , Shunhua Chang , Kiran V. Chatty , Robert J. Gauthier, Jr. , Junjun Li , Rahul Mishra , Mujahid Muhammad
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans, LLP
- Agent Anthony J. Canale
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/788 ; H02H9/00

Abstract:
An electrostatic discharge (ESD) protection circuit, methods of fabricating an ESD protection circuit, methods of providing ESD protection, and design structures for an ESD protection circuit. An NFET may be formed in a p-well and a PFET may be formed in an n-well. A butted p-n junction formed between the p-well and n-well results in an NPNP structure that forms an SCR integrated with the NFET and PFET. The NFET, PFET and SCR are configured to collectively protect a pad, such as a power pad, from ESD events. During normal operation, the NFET, PFET, and SCR are biased by an RC-trigger circuit so that the ESD protection circuit is in a high impedance state. During an ESD event while the chip is unpowered, the RC-trigger circuit outputs trigger signals that cause the SCR, NFET, and PFET to enter into conductive states and cooperatively to shunt ESD currents away from the protected pad.
Public/Granted literature
- US20120305984A1 SCR/MOS CLAMP FOR ESD PROTECTION OF INTEGRATED CIRCUITS Public/Granted day:2012-12-06
Information query
IPC分类: