Abstract:
A semiconductor circuit for electric overstress (EOS) protection is provided. The semiconductor circuit employs an electrostatic discharge (ESD) protection circuit, which has a resistor-capacitor (RC) time-delay network connected to a discharge capacitor. An electronic component that has voltage snapback property or a diodic behavior is connected to alter the logic state of the gate of the discharge transistor under an EOS event. Particularly, the electronic component is configured to turn on the gate of the discharge capacitor throughout the duration of an electrical overstress (EOS) condition as well as throughout the duration of an ESD event. A design structure may be employed to design or manufacture a semiconductor circuit that provides protection against an EOS condition without time limitation, i.e., without being limited by the time constant of the RC time delay network for EOS events that last longer than 1 microsecond.
Abstract:
An ESD power clamp circuit and method of ESD protection. The ESD power clamp circuit includes: a power clamp device coupled to a resistive/capacitive (RC) network, the RC network including a capacitor as the capacitive element of the RC network and one or more junction field effect transistors (JFETs) configured as variable resistors as the resistive element of the RC network.
Abstract:
An integrated circuit, design structures and methods of forming the integrated circuit which includes a signal pad ESD coupled to an I/O signal pad and a power supply ESD coupled to a source VDD. The signal pad ESD and the power supply ESD are integrated in a single ESD structure.
Abstract:
A structure and method of fabricating electrostatic discharge (EDS) circuitry in an integrated circuit chip by integrating a lateral bipolar, either a p-n-p with a NMOSFET or a n-p-n with a PMOSFET within a triple well. The lateral bipolar preferably includes diodes at the I/O and/or the VDDs of the circuitry.
Abstract:
A structure and apparatus is provided for an electrostatic discharge power clamp, for use with high voltage power supplies. The power clamp includes a network of transistor devices, for example, nFETs arranged in series between a power rail and a ground rail. The first transistor device is biased into a partially on-state, and thus, neither device sees the full voltage potential between the power rail and the ground rail. Accordingly, the power clamp can function in voltage environments higher than the native voltage of the transistor devices. Additionally, the second transistor device is controlled by an RC network functioning as a trigger which allows the second transistor device to turn on during a voltage spike such as occurs during an ESD event. The capacitor of the RC network may be small thereby requiring small real estate on the integrated circuit. The clamp may have fast turn-on times as well as conducting current for long periods of time after turning on.
Abstract:
Disclosed is a method for increasing substrate resistance in a silicon controlled rectifier in order to decrease turn on time so that the silicon controlled rectifier may be used as an effective electrostatic discharge protection device to protect against HBM, MM and CDM discharge events. Additionally, disclosed is an improved SCR structure that is adapted for use as an electrostatic discharge device to protect against human body model events by delivering an electrostatic discharge current directly to a ground rail. The improved SCR structure incorporates various features for increasing substrate resistance and, thereby, for decreasing turn on time. These features include a second n-well that functions as an obstacle to current flow, a narrow current flow channel between co-planar buried n-bands connected to a lower portion of the second n-well, a zero threshold voltage area, and an external resistor electrically connected between the SCR and the ground rail.
Abstract:
A method and apparatus for protection against electrostatic discharge (ESD) with improved latch-up robustness featuring a silicide blocked p-type field effect transistor is disclosed. The transistor has a snapback voltage that is less than the breakdown voltage of its gate oxide. The transistor is part of an integrated circuit and coupled to an I/O pad having no n-diffusions connected directly to it. A given integrated circuit may employ one or more the transistors configured in accordance with the invention that are associated with one or more I/O pads within the integrated circuit.
Abstract:
A structure and method of fabricating electrostatic discharge (EDS) circuitry in an integrated circuit chip by integrating a lateral bipolar, either a p-n-p with a NMOSFET or a n-p-n with a PMOSFET within a triple well. The lateral bipolar preferably includes diodes at the I/O and/or the VDDs of the circuitry.
Abstract:
An electrostatic discharge protection device, methods of fabricating an electrostatic discharge protection device, and design structures for an electrostatic discharge protection device. A drain of a first field-effect transistor and a diffusion resistor of higher electrical resistance may be formed as different portions of a doped region. The diffusion resistor, which is directly coupled with the drain of the first field-effect transistor, may be defined using an isolation region of dielectric material disposed in the doped region and selective silicide formation. The electrostatic discharge protection device may also include a second field-effect transistor having a drain as a portion the doped region that is directly coupled with the diffusion resistor and indirectly coupled by the diffusion resistor with the drain of the first field-effect transistor.
Abstract:
A vertical NPNP structure fabricated using a triple well CMOS process, as well as methods of making the vertical NPNP structure, methods of providing electrostatic discharge (ESD) protection, and design structures for a BiCMOS integrated circuit. The vertical NPNP structure may be used to provide on-chip protection to an input/output (I/O) pad from negative-voltage ESD events. A vertical PNPN structure may be also used to protect the same I/O pad from positive-voltage ESD events.