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US08357933B2 Manufacturing method of semiconductor integrated circuit device 失效
半导体集成电路器件的制造方法

Manufacturing method of semiconductor integrated circuit device
Abstract:
A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.
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