公开(公告)号：US20090017565A1

公开(公告)日：2009-01-15

申请号：US11816369

申请日：2005-03-11

申请人： Akio Hasebe ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Naoki Okamoto

发明人： Akio Hasebe ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Naoki Okamoto

IPC分类号： H01L21/66

CPC分类号： H01L24/10 ,  G01R31/2889 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014

摘要： A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.

摘要翻译： 在探针测试时，探针与测试垫接触，而不会破坏芯片中形成的电路。 因此，通过用螺母和螺栓固定，将装载夹具，压制工具，弹性体，粘合环和柱塞制成一体。 安装在弹簧保持夹具和负载夹具之间的弹簧的弹力用于使得用作这些弹簧的构件可以朝向垫PD压下。 从弹簧传递到柱塞到薄膜片的推力仅用于薄膜片的延伸。

公开(公告)号：US07776626B2

公开(公告)日：2010-08-17

申请号：US11816369

申请日：2005-03-11

申请人： Akio Hasebe ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Naoki Okamoto

发明人： Akio Hasebe ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Naoki Okamoto

IPC分类号： H01L21/66 ,  G01R31/02

CPC分类号： H01L24/10 ,  G01R31/2889 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014

摘要： A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.

摘要翻译： 在探针测试时，探针与测试垫接触，而不会破坏芯片中形成的电路。 因此，通过用螺母和螺栓固定，将装载夹具，压制工具，弹性体，粘合环和柱塞制成一体。 安装在弹簧保持夹具和负载夹具之间的弹簧的弹力用于使得用作这些弹簧的构件可以朝向垫PD压下。 从弹簧传递到柱塞到薄膜片的推力仅用于薄膜片的延伸。

公开(公告)号：US08357933B2

公开(公告)日：2013-01-22

申请号：US12839668

申请日：2010-07-20

申请人： Akio Hasebe ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Naoki Okamoto

发明人： Akio Hasebe ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka ,  Naoki Okamoto

IPC分类号： H01L21/66

CPC分类号： H01L24/10 ,  G01R31/2889 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014

摘要： A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet.

摘要翻译： 在探针测试时，探针与测试垫接触，而不会破坏芯片中形成的电路。 因此，通过用螺母和螺栓固定，将装载夹具，压制工具，弹性体，粘合环和柱塞制成一体。 安装在弹簧保持夹具和负载夹具之间的弹簧的弹力用于使得用作这些弹簧的构件可以朝向垫PD压下。 从弹簧传递到柱塞到薄膜片的推力仅用于薄膜片的延伸。

公开(公告)号：US07598100B2

公开(公告)日：2009-10-06

申请号：US11719112

申请日：2004-11-18

申请人： Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka

发明人： Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka

IPC分类号： H01L21/00 ,  H01L31/26 ,  H01L21/66 ,  H01L21/82

CPC分类号： G01R1/0735 ,  G01R3/00

摘要： As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and secure contact between probes 7 and test pads cannot be realized. For its prevention, the thin film sheet 2 and a bonding ring 6 are bonded in a state where a tensile force is applied only to the central region IA of the thin film sheet 2, and a tensile force is not applied to an outer peripheral region OA. Then, the height of the bonding ring 6 defining the height up to the probe surface of the thin film sheet 2 is increased, thereby increasing the height up to the probe surface of the thin film sheet 2.

摘要翻译： 随着用于防止多层布线基板1翘曲的卡夹的厚度增加，存在薄膜片2被埋在卡夹中并且不能实现探针7和测试垫之间的牢固接触的​​问题。 为了防止，薄膜片2和接合环6在仅向薄膜片2的中心区域IA施加张力的状态下接合，并且拉伸力不施加到外围区域 OA。 然后，限定高达薄膜片2的探针表面的高度的接合环6的高度增加，从而增加高达薄膜片2的探针表面的高度。

公开(公告)号：US20050093565A1

公开(公告)日：2005-05-05

申请号：US10968215

申请日：2004-10-20

申请人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

发明人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

IPC分类号： G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/66 ,  H01L21/822 ,  H01L27/04 ,  G01R31/26

CPC分类号： H01L22/14 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/00

摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

摘要翻译： 为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。 在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。 通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

公开(公告)号：US07901958B2

公开(公告)日：2011-03-08

申请号：US12853360

申请日：2010-08-10

申请人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

发明人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

IPC分类号： G01R31/26 ,  H01L21/66

CPC分类号： H01L22/14 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/00

摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

摘要翻译： 为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。 在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。 通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

公开(公告)号：US20110175634A1

公开(公告)日：2011-07-21

申请号：US13075666

申请日：2011-03-30

申请人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

发明人： Masayoshi Okamoto ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

IPC分类号： G01R31/3187 ,  G01R31/20

CPC分类号： H01L22/14 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/00

摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

公开(公告)号：US20100304510A1

公开(公告)日：2010-12-02

申请号：US12853360

申请日：2010-08-10

申请人： Masayoshi OKAMOTO ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

发明人： Masayoshi OKAMOTO ,  Yoshiaki Hasegawa ,  Yasuhiro Motoyama ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Ryuji Shibata ,  Yasunori Narizuka ,  Akira Yabushita ,  Toshiyuki Majima

IPC分类号： H01L21/66

CPC分类号： H01L22/14 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/00

摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

摘要翻译： 为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。 在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。 通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

公开(公告)号：US20090130785A1

公开(公告)日：2009-05-21

申请号：US11719112

申请日：2004-11-18

申请人： Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka

发明人： Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Masayoshi Okamoto ,  Yasunori Narizuka

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： G01R1/0735 ,  G01R3/00

摘要： As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and secure contact between probes 7 and test pads cannot be realized. For its prevention, the thin film sheet 2 and a bonding ring 6 are bonded in a state where a tensile force is applied only to the central region IA of the thin film sheet 2, and a tensile force is not applied to an outer peripheral region OA. Then, the height of the bonding ring 6 defining the height up to the probe surface of the thin film sheet 2 is increased, thereby increasing the height up to the probe surface of the thin film sheet 2.

摘要翻译： 随着用于防止多层布线基板1翘曲的卡夹的厚度增加，存在薄膜片2被埋在卡夹中并且不能实现探针7和测试垫之间的牢固接触的​​问题。 为了防止，薄膜片2和接合环6在仅向薄膜片2的中心区域IA施加张力的状态下接合，并且拉伸力不施加到外围区域 OA。 然后，限定高达薄膜片2的探针表面的高度的接合环6的高度增加，从而增加高达薄膜片2的探针表面的高度。

公开(公告)号：US07271015B2

公开(公告)日：2007-09-18

申请号：US11100600

申请日：2005-04-07

申请人： Masayoshi Okamoto ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Akira Shimase

发明人： Masayoshi Okamoto ,  Hideyuki Matsumoto ,  Shingo Yorisaki ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Akira Shimase

IPC分类号： H01L21/66

CPC分类号： G01R3/00 ,  G01R1/07307

摘要： Electrical testing is to be performed on a semiconductor integrated circuit device which the test pads formed. To facilitate such testing, the method of manufacture of the semiconductor integrated circuit device employs a probe card which has two or more contact terminals which can contact two or more electrodes. This probe card includes, in opposition to a wiring substrate of the semiconductor integrated circuit device in which a first wiring is formed, a first sheet having two or more contact terminals to contact the two or more electrodes; a second wiring electrically connected to the two or more contact terminals and the first wiring; and first dummy wirings which are near the region of formation of the two or more contact terminals, are arranged to a non-forming region of the second wiring, and do not participate in signal transfer.