发明授权
US08369978B2 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
有权
通过在加工过程中使用基板的光谱监测来调整抛光速率
- 专利标题： Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
- 专利标题（中）： 通过在加工过程中使用基板的光谱监测来调整抛光速率
-
申请号： US12553870申请日： 2009-09-03
-
公开(公告)号： US08369978B2公开(公告)日： 2013-02-05
- 发明人: Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
- 申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials
- 当前专利权人： Applied Materials
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson P.C.
- 主分类号： G06F19/00
- IPC分类号： G06F19/00 ; B24B49/00 ; H01L21/00 ; H01L21/302 ; G01N21/00 ; G01B11/28 ; G01B11/02
摘要：
A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
公开/授权文献
信息查询
