发明授权
- 专利标题: Semiconductor memory device and manufacturing method thereof
- 专利标题(中): 半导体存储器件及其制造方法
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申请号: US13164931申请日: 2011-06-21
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公开(公告)号: US08377814B2公开(公告)日: 2013-02-19
- 发明人: Atsuhiro Sato , Hiroyuki Nitta , Fumitaka Arai
- 申请人: Atsuhiro Sato , Hiroyuki Nitta , Fumitaka Arai
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2008-227001 20080904
- 主分类号: H01L21/28
- IPC分类号: H01L21/28
摘要:
A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
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