Invention Grant
- Patent Title: Sensor device with sealing structure
- Patent Title (中): 带密封结构的传感器
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Application No.: US13091997Application Date: 2011-04-21
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Publication No.: US08384168B2Publication Date: 2013-02-26
- Inventor: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
- Applicant: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L29/84
- IPC: H01L29/84 ; G01L7/08
Abstract:
Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
Public/Granted literature
- US20120266684A1 SENSOR DEVICE WITH SEALING STRUCTURE Public/Granted day:2012-10-25
Information query
IPC分类:
