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1.
公开(公告)号:US20120270354A1
公开(公告)日:2012-10-25
申请号:US13092001
申请日:2011-04-21
申请人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
IPC分类号: H01L21/02
CPC分类号: B81C1/0023 , B81B2201/0264 , G01L19/141 , G01L19/148 , H01L2224/48247
摘要: Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
摘要翻译: 为传感器装置提供制造方法。 示例性的制造方法包括使用密封结构粘合传感器结构和另一结构。 密封结构围绕传感器结构的隔膜区域,并且在传感器结构和另一结构之间提供气密密封,以在隔膜区域的一侧上建立固定的参考压力。
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公开(公告)号:US20120266684A1
公开(公告)日:2012-10-25
申请号:US13091997
申请日:2011-04-21
申请人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
CPC分类号: G01L9/0052 , B81B7/0041 , B81B2201/0264 , B81B2207/012 , G01L19/0672 , G01L19/147 , H01L2224/16225 , H01L2924/15151 , H01L2924/16152
摘要: Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
摘要翻译: 为传感器装置提供了装置和相关的制造方法。 该传感器装置包括传感器结构,该传感器结构包括其上形成有感测装置的第一部分和第二结构。 在传感器结构和第二结构之间插入密封结构,其中密封结构围绕传感器结构的第一部分。 密封结构在第一部分的第一侧上建立固定的参考压力,并且第一部分的相对侧暴露于环境压力。
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3.
公开(公告)号:US08476087B2
公开(公告)日:2013-07-02
申请号:US13092001
申请日:2011-04-21
申请人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
IPC分类号: H01L21/66
CPC分类号: B81C1/0023 , B81B2201/0264 , G01L19/141 , G01L19/148 , H01L2224/48247
摘要: Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
摘要翻译: 为传感器装置提供制造方法。 示例性的制造方法包括使用密封结构粘合传感器结构和另一结构。 密封结构围绕传感器结构的隔膜区域,并且在传感器结构和另一结构之间提供气密密封,以在隔膜区域的一侧上建立固定的参考压力。
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公开(公告)号:US08384168B2
公开(公告)日:2013-02-26
申请号:US13091997
申请日:2011-04-21
申请人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
CPC分类号: G01L9/0052 , B81B7/0041 , B81B2201/0264 , B81B2207/012 , G01L19/0672 , G01L19/147 , H01L2224/16225 , H01L2924/15151 , H01L2924/16152
摘要: Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
摘要翻译: 为传感器装置提供了装置和相关的制造方法。 该传感器装置包括传感器结构,该传感器结构包括其上形成有感测装置的第一部分和第二结构。 在传感器结构和第二结构之间插入密封结构,其中密封结构围绕传感器结构的第一部分。 密封结构在第一部分的第一侧上建立固定的参考压力,并且第一部分的相对侧暴露于环境压力。
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