发明授权
- 专利标题: System and method for implementing multi-resolution advanced process control
- 专利标题(中): 实现多分辨率高级过程控制的系统和方法
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申请号: US13106711申请日: 2011-05-12
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公开(公告)号: US08394719B2公开(公告)日: 2013-03-12
- 发明人: Andy Tsen , Jin-Ning Sung , Po-Feng Tsai , Jong-I Mou , Yen-Wei Cheng
- 申请人: Andy Tsen , Jin-Ning Sung , Po-Feng Tsai , Jong-I Mou , Yen-Wei Cheng
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L21/302
- IPC分类号: H01L21/302 ; H01L21/461
摘要:
System and method for implementing multi-resolution advanced process control (“APC”) are described. One embodiment is a method including obtaining low resolution metrology data and high resolution metrology data related to a process module for performing a process on the wafer. A process variable of the process is modeled as a function of the low resolution metrology data to generate a low-resolution process model and the process variable is modeled as a function of the high resolution metrology data to generate a high-resolution process model. The method further includes calibrating the low resolution process model; combining the calibrated low resolution process model with the high resolution process model to generate a multi-resolution process model that models the process variable as a function of both the low resolution metrology data and the high resolution metrology data; and analyzing a response of the multi-resolution process model and the low and high resolution metrology data to control performance of a process module.